Methods Of Depositing A Metal Alloy Film
First Claim
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1. A method of depositing an alloy film, the method comprising:
- positioning a substrate within a processing chamber;
exposing at least a portion of the substrate to a metal halide precursor to provide a first metal on the substrate;
purging unreacted metal halide precursor from the processing chamber; and
exposing the portion of the substrate to an organometallic reducing agent comprising a second metal different from the first metal to deposit the second metal on the substrate resulting in an alloy of the first metal and the second metal.
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Abstract
Provided are methods of depositing films comprising exposing at least a portion of a substrate to a metal precursor to provide a first metal on the substrate and an organometallic reducing agent to deposit a second metal on the substrate to form a mixture or alloy of the first metal and the second metal. Exposure to the metal precursor and organometallic reducing agent can be in either order or simultaneously.
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Citations
20 Claims
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1. A method of depositing an alloy film, the method comprising:
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positioning a substrate within a processing chamber; exposing at least a portion of the substrate to a metal halide precursor to provide a first metal on the substrate; purging unreacted metal halide precursor from the processing chamber; and exposing the portion of the substrate to an organometallic reducing agent comprising a second metal different from the first metal to deposit the second metal on the substrate resulting in an alloy of the first metal and the second metal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of depositing an alloy film, the method comprising:
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positioning a substrate within a processing chamber; and simultaneously flowing a metal halide precursor to provide a first metal and an organometallic reducing agent comprising a second metal different from the first metal into the processing chamber to deposit an alloy film comprising the first metal and the second metal. - View Dependent Claims (16, 17, 18, 19)
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20. A method of depositing an alloy film, the method comprising:
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positioning a substrate within a processing chamber; and flowing a metal halide precursor to provide a first metal into the processing chamber to contact a portion of the substrate; and flowing an organometallic reducing agent comprising a second metal different from the first metal into the processing chamber to contact a portion of the substrate, wherein the metal halide and organometallic reducing agent are simultaneously flowed into different regions of the processing chamber and are separated by an inert gas curtain to prevent gas phase reaction of the metal halide and organometallic reducing agent.
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Specification