SYSTEM AND METHOD FOR DISPENSING LIQUID SPIN-ON GLASS (SOG) ONTO SEMICONDUCTOR WAFERS

• US 20150004720A1
• Filed: 06/28/2013
• Published: 01/01/2015
• Est. Priority Date: 06/28/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: LIU, Yung-Tsun
• Granted Patent: US 10,446,390 B2
• Time in Patent Office: Days
• US Class Current: 438/7
• CPC Class Codes: B05C 11/02 Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means thereforB05C7/00 takes precedence; Hand tools for such purposes B05C17/10; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surfacecontrolling supply of liquid or other fluent material B05C11/10
• CPC Class Codes: B05C 11/08 Spreading liquid or other fluent material by manipulating the work, e.g. tilting
• CPC Class Codes: B05D 1/005 Spin coating
• CPC Class Codes: H01L 21/02126 the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
• CPC Class Codes: H01L 21/02137 the material comprising alkyl silsesquioxane, e.g. MSQ
• CPC Class Codes: H01L 21/02282 liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence

Abstract

A device and method for dispensing liquid spin-on glass (SOG) onto semiconductor wafers. The method includes dispensing liquid SOG through a dispenser nozzle, detecting liquid SOG outside of the dispenser nozzle, indicating the presence of liquid SOG in an abnormal length relative to the dispenser nozzle and adjusting a suck back (SB) valve to withdraw liquid SOG from the abnormal length.

Claims

1. A method of controlling deposition of liquid spin-on glass (SOG) onto a semiconductor wafer, comprising:

detecting the liquid SOG outside of a dispenser nozzle in an abnormal length relative to the dispenser nozzle; and

adjusting a suck back (SB) valve to withdraw liquid SOG from the abnormal length.

2. The method of claim 1, further comprising:

comparing a sensed amount of liquid SOG deposited onto the semiconductor wafer with at least one operating parameter prior to the adjusting.

3. The method of claim 1, wherein the detecting comprises sensing the liquid SOG with a laser/photodetector pair by indicating a change in laser light received by the photodetector.

4. The method of claim 3, wherein the laser light movably scans for the presence of liquid SOG.

5. The method of claim 1, wherein the detecting comprises sensing liquid SOG outside of the dispenser nozzle by a change in detected sound, infrared light or radar.

6. The method of claim 1, wherein the detecting comprises sensing liquid SOG outside of the dispenser nozzle by a change in a detected magnetic field or electric field.

7. The method of claim 1, further comprising:

halting deposition of the liquid SOG onto the semiconductor wafer.

8. The method of claim 7, further comprising:

activating an alarm.

9. The method of claim 1, wherein the adjusting the SB valve to withdraw the liquid SOG from the abnormal length comprises activating the SB valve with an electromagnetic actuator.

10. The method of claim 1, wherein the adjusting the SB valve to withdraw the liquid SOG from the abnormal length comprises transmitting a switch valve control signal to a first electromagnetic actuator and transmitting an adjustment valve control signal to a second electromagnetic actuator.

11. The method of claim 1, wherein the adjusting comprises closing a switch valve in the SB valve and moving an adjustment valve in the SB valve.

12. A liquid spin-on glass (SOG) depositing system, comprising:

a suck back (SB) valve arranged to receive SOG;

a SOG dispenser having a nozzle, the SOG dispenser coupled with the SB valve for receiving SOG;

a detector positioned to detect SOG outside the nozzle; and

an SB valve controller coupled with the detector for receiving one or more signals from the detector and coupled with the SB valve for controlling operation of the SB valve.

13. The device of claim 12, the SB valve comprising a switch valve and an adjustment valve.

14. The device of claim 13, wherein the switch valve is adapted to be moved with a first electromagnetic actuator.

16. The device of claim 13, wherein the switch valve is spring loaded.

17. The device of claim 13, wherein the adjustment valve is spring loaded.

15. The device of claim 15, wherein the adjustment valve is adapted to be moved with a second electromagnetic actuator.

18. A method of manufacturing a semiconductor device, comprising:

detecting liquid SOG outside of a dispenser nozzle in an abnormal length relative to the dispenser nozzle; and

adjusting a suck back (SB) valve to withdraw liquid SOG from the abnormal length.

19. The method of claim 18, further comprising:

comparing a sensed amount of liquid SOG deposited onto the semiconductor wafer from the dispensing with at least one set operating parameter.

20. The method of claim 18, wherein the detecting comprises sensing the liquid SOG by detecting a change in light.