Plasma Processing Chamber with Dual Axial Gas Injection and Exhaust
First Claim
1. A method for semiconductor wafer processing, comprising:
- holding a semiconductor wafer in a substantially parallel orientation to a gas distribution unit such that a plasma processing volume is formed between the semiconductor wafer and the gas distribution unit;
flowing a plasma processing gas from within the gas distribution unit into the plasma processing volume in a direction substantially perpendicular to the semiconductor wafer; and
directing an exhaust flow of plasma processing gas from within the plasma processing volume through the gas distribution unit in a direction substantially perpendicular to the semiconductor wafer, whereby the exhaust flow of plasma processing gas through the gas distribution unit is the only exhaust flow of plasma processing gas from within the plasma processing volume.
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Abstract
An electrode is exposed to a plasma generation volume and is defined to transmit radiofrequency power to the plasma generation volume, and includes an upper surface for holding a substrate in exposure to the plasma generation volume. A gas distribution unit is disposed above the plasma generation volume and in a substantially parallel orientation to the electrode. The gas distribution unit includes an arrangement of gas supply ports for directing an input flow of a plasma process gas into the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode. The gas distribution unit also includes an arrangement of through-holes that each extend through the gas distribution unit to fluidly connect the plasma generation volume to an exhaust region. Each of the through-holes directs an exhaust flow from the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode.
94 Citations
20 Claims
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1. A method for semiconductor wafer processing, comprising:
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holding a semiconductor wafer in a substantially parallel orientation to a gas distribution unit such that a plasma processing volume is formed between the semiconductor wafer and the gas distribution unit; flowing a plasma processing gas from within the gas distribution unit into the plasma processing volume in a direction substantially perpendicular to the semiconductor wafer; and directing an exhaust flow of plasma processing gas from within the plasma processing volume through the gas distribution unit in a direction substantially perpendicular to the semiconductor wafer, whereby the exhaust flow of plasma processing gas through the gas distribution unit is the only exhaust flow of plasma processing gas from within the plasma processing volume. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for semiconductor wafer processing, comprising:
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positioning an outer peripheral structure on a top surface of a chuck so as to form an uninterrupted fluid seal between a bottom surface of the outer peripheral structure and the top surface of the chuck, the outer peripheral structure extending in a solid form from a top surface of the outer peripheral structure to the bottom surface of the outer peripheral structure, the outer peripheral structure surrounding and enclosing a perimeter of a plasma generation volume above the chuck; and positioning a gas distribution unit above the plasma generation volume so as to extend across the plasma generation volume in a substantially parallel orientation with respect to the chuck, and so as to form an uninterrupted fluid seal between the top surface of the outer peripheral structure and the gas distribution unit around the perimeter of the plasma generation volume, the gas distribution unit separating the plasma generation volume from an exhaust region, the gas distribution unit including an arrangement of gas supply ports configured to direct an input flow of a plasma process gas into the plasma generation volume, the gas distribution unit including an arrangement of through-holes that each extend through the gas distribution unit to fluidly connect the plasma generation volume to the exhaust region. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 19, 20)
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18. A method for semiconductor wafer processing as recited in claim 18, wherein the multiple gas supply regions includes a center gas supply region and one or more annular gas supply regions defined concentrically about the center gas supply region across the gas distribution unit such that each of the one or more annular gas supply regions circumscribes the center gas supply region.
Specification