×

JOINT COMPOUND, WALL ASSEMBLY, AND METHODS AND PRODUCTS RELATED THERETO

  • US 20150007519A1
  • Filed: 09/22/2014
  • Published: 01/08/2015
  • Est. Priority Date: 09/25/2012
  • Status: Active Grant
First Claim
Patent Images

1. A kit for assembling at least one of the following:

  • a wall and a ceiling, the kit comprising;

    (a) at least two gypsum boards, each of the boards having at least one tapered edge with a recess depth at the deepest point in the range from about 0.005 inch to about 0.125 inch; and

    (b) a drying-type joint compound with shrinkage of less than 15% by volume as measured by ASTM C474-05, the drying-type joint compound comprising a plurality of hollow spheres and a binder selected from the group consisting of acrylic acid polymers, acrylic acid copolymers, alkyds, polyurethanes, polyesters, epoxies, and combinations thereof;

    wherein the hollow spheres have an average isostatic crush strength of at least about 250 psi as measured according to ASTM D3102-78; and

    wherein the density of the spheres is from about 0.0015 lb/in3 (about 0.04 g/cm3) to about 0.04 lb/in3 (about 1.1 g/cm3).

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×