METHOD FOR MANUFACTURING CONDUCTIVE MEMBER, CONDUCTIVE MEMBER, AND TOUCH PANEL USING SAME

• US 20150009432A1
• Filed: 09/22/2014
• Published: 01/08/2015
• Est. Priority Date: 03/23/2012
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: KATAGIRI, Kensuke
• Granted Patent: US 9,411,080 B2
• Time in Patent Office: Days
• US Class Current: 349/12
• CPC Class Codes: C23C 18/08 characterised by the deposition of metallic material
• CPC Class Codes: G02B 5/0242 by means of dispersed particles
• CPC Class Codes: G02B 5/0268 characterized by the fabrication or manufacturing method
• CPC Class Codes: G02F 1/13338 Input devices, e.g. touch panels
• CPC Class Codes: G02F 1/133504 Diffusing, scattering, diffracting elements associated to illuminating devices G02F1/133606
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G02F 1/133541 Circular polarisers
• CPC Class Codes: G02F 1/13439 characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/09881 Coating only between conductors, i.e. flush with the conductors
• CPC Class Codes: H05K 2203/0571 Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H10K 50/81 Anodes
• CPC Class Codes: H10K 50/854 comprising scattering means

Abstract

A method for manufacturing of a conductive member include

• • forming one of a conductive layer including metal nanowires or a light-scattering layer including insulating light-scattering fine particles on a substrate in a pattern shape; and
  • forming the other of the conductive layer including metal nanowires or the light-scattering layer including insulating light-scattering fine particles on a space of the substrate wherein the one of the conductive layer or the light-scattering layer is not formed.

Claims

1. A method for manufacturing a conductive member, comprising:

forming a conductive layer including metal nanowires on a substrate in a pattern shape, and then

forming a light-scattering layer including insulating light-scattering fine particles on a space of the substrate wherein the conductive layer is not formed;

or

forming a light-scattering layer including insulating light-scattering fine particles on a substrate in a pattern shape, and then

forming a conductive layer including metal nanowires on a space of the substrate wherein the light-scattering layer is not formed.

2. The method for manufacturing a conductive member according to claim 1,

wherein a ratio of haze between the conductive layer and the light-scattering layer calculated by dividing a haze of the light-scattering layer by a haze of the conductive layer is in a range of 0.7 to 1.3.

3. The method for manufacturing a conductive member according to claim 1,

wherein the conductive layer and the light-scattering layer include a matrix obtained by hydrolyzing and polycondensing a compound represented by the following general formula (II),

M¹(OR¹)_aR²_4-a 

 

(II)

in the general formula (II), M¹ represents an element selected from Si, Ti, and Zr, each of R¹ and R² individually represents a hydrogen atom or a hydrocarbon group, and a represents an integer of 2 to 4.

4. The method for manufacturing a conductive member according to claim 1,

wherein an average short axis length of the metal nanowires is 150 nm or less.

5. The method for manufacturing a conductive member according to claim 1,

wherein an average long axis length of the metal nanowires is in a range of 1 μ

m to 40 μ

m.

6. The method for manufacturing a conductive member according to claim 1,

wherein a content of the metal nanowires configuring the conductive layer is in a range of 1.0 mg/m² to 150.0 mg/m² in the conductive layer.

7. The method for manufacturing a conductive member according to claim 1,

wherein the metal nanowires comprise silver.

8. The method for manufacturing a conductive member according to claim 1,

wherein a difference in thickness between the conductive layer and the light-scattering layer is 500% or less of a thickness of the thinner layer of the conductive layer or the light-scattering layer.

9. The method for manufacturing a conductive member according to claim 1,

wherein forming the conductive layer including metal nanowires on the substrate in the pattern shape or forming the light-scattering layer including insulating light-scattering fine particles on the substrate in the pattern shape is respectively achieved by applying an etching mask in the pattern shape onto the conductive layer or the light-scattering layer, and applying a liquid capable of dissolving the conductive layer or the light-scattering layer to an opening of the etching mask.

10. The method for manufacturing a conductive member according to claim 1,

wherein forming the conductive layer including metal nanowires on the substrate in the pattern shape or forming the light-scattering layer including insulating light-scattering fine particles on the substrate in the patter shape is respectively achieved by printing a photoresist in the pattern shape on the conductive layer or the light-scattering layer, and applying a liquid capable of dissolving the conductive layer or the light-scattering layer to an opening of the photoresist.

11. The method for manufacturing a conductive member according to claim 9, further comprising;

forming the light-scattering or the conductive layer in the opening of the etching mask after applying the liquid capable of dissolving the conductive layer or the light-scattering layer, and

peeling the etching mask off.

12. The method for manufacturing a conductive member according to claim 1,

wherein forming the conductive layer including metal nanowires on the substrate in the pattern shape or forming the light-scattering layer including insulating light-scattering fine particles on the substrate in the pattern shape is respectively achieved by printing the conductive layer or the light-scattering layer in the pattern shape.

13. The method for manufacturing a conductive member according to claim 1,

wherein forming the conductive layer including metal nanowires on the substrate in the pattern shape or forming the light-scattering layer including insulating light-scattering fine particles on the substrate in the pattern shape is respectively achieved by pattern-exposing and developing the conductive layer or the light-scattering layer.

14. The method for manufacturing a conductive member according to claim 1,

wherein forming the conductive layer including the metal nanowires on the substrate in the pattern shape, and then

forming the light-scattering layer including the insulating light-scattering fine particles on the space of the substrate wherein the conductive layer is not formed.

15. The method for manufacturing a conductive member according to claim 1,

wherein forming the light-scattering layer including the insulating light-scattering fine particles on the substrate in the pattern shape, and then

forming the conductive layer including the metal nanowires on the space of the substrate wherein the light-scattering layer is not formed.

16. A conductive member comprising:

a substrate;

a conductive layer including metal nanowires; and

a light-scattering layer including at least insulating light-scattering fine particles,

wherein the number of the metal nanowires per unit area of the light-scattering layer is 5% or less with respect to the number of the metal nanowires per unit area of the conductive layer, and

the number of the insulating light-scattering fine particles per unit area of the conductive layer is 5% or less with respect to the number of the insulating light-scattering fine particles per unit area of the light-scattering layer.

17. The conductive member according to claim 16,

wherein a ratio of haze between the conductive layer and the light-scattering layer calculated by dividing a haze of the light-scattering layer by a haze of the conductive layer is 0.7 to 1.3.

18. A polarizing plate comprising:

the conductive member according to claim 16.

19. A circularly polarizing plate comprising:

the conductive member according to claim 16.

20. A display apparatus comprising:

the conductive member according to claim 16.

21. A display apparatus comprising:

the polarizing plate according to claim 18.

22. A display apparatus comprising:

the circularly polarizing plate according to claim 19.

23. A touch panel comprising:

the conductive member according to claim 16.