SEMICONDUCTOR LIGHT-EMITTING MODULE AND VEHICLE LUMINAIRE

• US 20150009702A1
• Filed: 02/20/2012
• Published: 01/08/2015
• Est. Priority Date: 02/25/2011
• Status: Active Grant

• Current Assignee: Osram Beteiligungsverwaltung GmbH (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Fiederling, Roland, Frey, Peter, Kaps, Harald, Trommer, Jenny
• Granted Patent: US 9,453,638 B2
• Time in Patent Office: Days
• US Class Current: 362/547
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21S 41/151 arranged in one or more lines
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 45/30 Ventilation or drainage of lighting devices
• CPC Class Codes: F21S 45/43 using gas
• CPC Class Codes: F21S 45/435 circulating the gas within a closed system
• CPC Class Codes: F21S 45/60 Heating of lighting devices, e.g. for demisting
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 23/008 the casing being outside the housing of the lighting device
• CPC Class Codes: F21V 29/677 the fans being used for discharging
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/90 Heating arrangements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F21Y 2115/15 Organic light-emitting diodes [OLED]
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

A semiconductor light-emitting module includes a housing, at least one cooling body accommodated in the housing wherein the cooling body is thermally connected to at least one semiconductor light source, an active cooling device accommodated in the housing, and at least one electronics unit accommodated in the housing, at least for actuating the at least one semiconductor light source, wherein the housing has a leadthrough opening, and the at least one semiconductor light source is arranged in the region of the leadthrough opening.

Claims

1. A semiconductor light-emitting module, comprising:

a housing,

at least one cooling body accommodated in the housing wherein the cooling body is thermally connected to at least one semiconductor light source,

an active cooling device accommodated in the housing, and

at least one electronics unit accommodated in the housing, at least for actuating the at least one semiconductor light source,

wherein the housing has a leadthrough opening, and the at least one semiconductor light source is arranged in the region of the leadthrough opening.

2. The semiconductor light-emitting module as claimed in claim 1, wherein the active cooling device has at least one fan.

3. The semiconductor light-emitting module as claimed in claim 2, wherein at least one air guide element is accommodated in the housing.

4. The semiconductor light-emitting module as claimed in claim 1, wherein the housing is a sealed housing.

5. The semiconductor light-emitting module as claimed in claim 1, wherein the housing has at least one ventilation opening.

6. The semiconductor light-emitting module as claimed in claim 5, wherein the housing has a plurality of ventilation openings, of which at least some are arranged in the vicinity of the electronics unit.

7. The semiconductor light-emitting module as claimed in claim 1, wherein at least one further fan is arranged on the electronics unit.

8. The semiconductor light-emitting module as claimed in claim 1, wherein the electronics unit has a leadthrough opening, which is above the leadthrough opening in the housing, wherein the at least one semiconductor light source is arranged in the region of the leadthrough openings.

9. The semiconductor light-emitting module as claimed in claim 1, wherein the electronics unit is integrated in a wall of the housing.

10. The semiconductor light-emitting module as claimed in claim 8, wherein the leadthrough opening in the housing corresponds to the leadthrough opening in the electronics unit.

11. The semiconductor light-emitting module as claimed in claim 1, wherein the electronics unit has at least one air passage opening.

12. The semiconductor light-emitting module as claimed in claim 1, wherein at least one heating source is accommodated in the housing.

13. A vehicle luminaire, having at least one semiconductor light-emitting module comprising:

a housing,

at least one cooling body accommodated in the housing wherein the cooling body is thermally connected to at least one semiconductor light source,

an active cooling device accommodated in the housing, and

at least one electronics unit accommodated in the housing, at least for actuating the at least one semiconductor light source,

wherein the housing has a leadthrough opening, and the at least one semiconductor light source is arranged in the region of the leadthrough opening.