BONDING DEVICE AND BONDING METHOD

• US 20150017782A1
• Filed: 07/08/2014
• Published: 01/15/2015
• Est. Priority Date: 07/10/2013
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: TANAKA, Hideaki, YAMAMOTO, Masahiro, AKIYAMA, Naoki, SUGIYAMA, Masahiko, OMORI, Yosuke, AKAIKE, Shinji
• Application Number:
  US14/325,685
• Publication Number:
  US 20150017782A1
• Time in Patent Office: Days
• US Class Current: 438/455
• CPC Class Codes: H01L 21/2007 Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer H01L21/2011 takes precedence; bonding of semiconductor wafers to semiconductor wafers for junction formation H01L21/187
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 24/741 Apparatus for manufacturing means for bonding, e.g. connectors
• CPC Class Codes: Y10T 156/1744 Means bringing discrete articles into assembled relationship

Abstract

A bonding device for bonding substrates together, includes: a first holding unit configured to hold a first substrate on a lower surface thereof; a second holding unit located below the first holding unit and configured to hold a second substrate on an upper surface thereof; a moving mechanism configured to move the first holding unit or the second holding unit in a horizontal direction and a vertical direction; a first image pickup unit located in the first holding unit and configured to pick up an image of the second substrate held in the second holding unit; and a second image pickup unit located in the second holding unit and configured to pick up an image of the first substrate held in the first holding unit, at least one of the first image pickup unit and the second image pickup unit including an infrared camera.

Claims

1. A bonding device for bonding substrates together, comprising:

a first holding unit configured to hold a first substrate on a lower surface of the first holding unit;

a second holding unit located below the first holding unit and configured to hold a second substrate on an upper surface of the second holding unit;

a moving mechanism configured to move the first holding unit or the second holding unit in a horizontal direction and a vertical direction;

a first image pickup unit located in the first holding unit and configured to pick up an image of the second substrate held in the second holding unit; and

a second image pickup unit located in the second holding unit and configured to pick up an image of the first substrate held in the first holding unit,

at least one of the first image pickup unit and the second image pickup unit including an infrared camera.

2. The bonding device of claim 1, wherein each of the first image pickup unit and the second image pickup unit includes a visible light camera.

3. The bonding device of claim 2, wherein the infrared camera and the visible light camera include a common micro lens, and the visible light camera further includes a macro lens.

4. The bonding device of claim 1, further comprising:

a control unit configured to control operations of the moving mechanism, the first image pickup unit and the second image pickup unit,

the control unit being configured to control the first image pickup unit to pick up an image of the second substrate not yet bonded, to control the second image pickup unit to pick up an image of the first substrate not yet bonded, and then to control the moving mechanism to adjust horizontal positions of the first holding unit and the second holding unit based on the image picked up by the first image pickup unit and the image picked up by the second image pickup unit.

5. The bonding device of claim 1, further comprising:

a control unit configured to control operations of the moving mechanism, the first image pickup unit and the second image pickup unit,

the control unit being configured to control the infrared camera to pick up an image of an overlapped substrate obtained by bonding the first substrate and the second substrate so as to inspect the overlapped substrate, and then to control the moving mechanism to adjust horizontal positions of the first holding unit and the second holding unit based on an inspection result.

6. The bonding device of claim 1, wherein the first holding unit, the second holding unit, the moving mechanism, the first image pickup unit and the second image pickup unit are located within a processing vessel, the first holding unit being fixed within the processing vessel, and the moving mechanism configured to move the second holding unit in the horizontal direction and the vertical direction.

7. A bonding method for bonding substrates with a bonding device which includes a first holding unit configured to hold a first substrate on a lower surface of the first holding unit, a second holding unit located below the first holding unit and configured to hold a second substrate on an upper surface of the second holding unit, a moving mechanism configured to move the first holding unit or the second holding unit in a horizontal direction and a vertical direction, a first image pickup unit located in the first holding unit and configured to pick up an image of the second substrate held in the second holding unit, and a second image pickup unit located in the second holding unit and configured to pick up an image of the first substrate held in the first holding unit, at least one of the first image pickup unit and the second image pickup unit including an infrared camera, the method comprising:

picking up images of the second substrate not yet bonded and the first substrate not yet bonded by the first image pickup unit and the second image pickup unit, respectively; and

adjusting horizontal positions of the first holding unit and the second holding unit by the moving mechanism based on the images thus picked up.

8. The bonding method of claim 7, wherein each of the first image pickup unit and the second image pickup unit includes a visible light camera, and

wherein, in picking up images of the second substrate not yet bonded and the first substrate not yet bonded, the infrared camera picks up an image of the first substrate made up of a plurality of substrates or an image of the second substrate made up of a plurality of substrates, and the visible light camera picks up an image of the first substrate made up of a single substrate or an image of the second substrate made up of a single substrate.

9. The bonding method of claim 8, wherein the infrared camera and the visible light camera include a common micro lens, and the visible light camera further includes a macro lens,

wherein, prior to picking up images of the second substrate not yet bonded and the first substrate not yet bonded, an image of the second substrate is picked up by the macro lens of the first image pickup unit and then the horizontal positions of the first holding unit and the second holding unit are adjusted by the moving mechanism,

wherein, in picking up images of the second substrate not yet bonded and the first substrate not yet bonded, images of the first substrate and the second substrate are picked up by the micro lens, and

wherein, in adjusting horizontal positions of the first holding unit and the second holding unit, the horizontal positions of the first holding unit and the second holding unit are adjusted by the moving mechanism.

10. The bonding method of claim 7, further comprising:

after adjusting horizontal positions of the first holding unit and the second holding unit, bonding the first substrate held in the first holding unit and the second substrate held in the second holding unit to each other to form an overlapped substrate;

inspecting the overlapped substrate by picking up an image of the overlapped substrate by the infrared camera; and

then

adjusting the horizontal positions of the first holding unit and the second holding unit by the moving mechanism based on an inspection result.

14. The bonding method of claim 7, wherein the first holding unit, the second holding unit, the moving mechanism, the first image pickup unit and the second image pickup unit are located within a processing vessel, the first holding unit being fixed within the processing vessel, and the moving mechanism being configured to move the second holding unit in the horizontal direction and the vertical direction.

11. A bonding method for bonding substrates with a bonding device which includes a first holding unit configured to hold a first substrate on a lower surface of the first holding unit, a second holding unit located below the first holding unit and configured to hold a second substrate on an upper surface of the second holding unit, a moving mechanism configured to move the first holding unit or the second holding unit in a horizontal direction and a vertical direction, a first image pickup unit located in the first holding unit and configured to pick up an image of the second substrate held in the second holding unit, and a second image pickup unit located in the second holding unit and configured to pick up an image of the first substrate held in the first holding unit, at least one of the first image pickup unit and the second image pickup unit including an infrared camera, the method comprising:

obtaining an image for inspection of an overlapped substrate obtained by bonding the first substrate and the second substrate using the infrared camera; and

adjusting horizontal positions of the first holding unit and the second holding unit with the moving mechanism based on the image for inspection obtained from the infrared camera.

12. The bonding method of claim 11, wherein each of the first image pickup unit and the second image pickup unit includes a visible light camera, and the bonding method further comprises:

prior to obtaining an image for inspection of an overlapped substrate, adjusting the horizontal positions of the first holding unit and the second holding unit with the moving mechanism based on images of the second substrate not yet bonded and the first substrate not yet bonded, the image of the second substrate not yet bonded being picked up by the visible light camera of the first image pickup unit and the image of the first substrate not yet bonded being picked up by the visible light camera of the second image pickup unit.

13. The bonding method of claim 12, wherein the infrared camera and the visible light camera include a common micro lens, and the visible light camera further includes a macro lens, and

wherein, adjusting the horizontal positions of the first holding unit and the second holding unit includes:

picking up an image of the second substrate with the macro lens of the first image pickup unit and then adjusting the horizontal positions of the first holding unit and the second holding unit with the moving mechanism; and

picking up images of the second substrate and the first substrate with the micro lens of the first image pickup unit and with the micro lens of the second image pickup unit, respectively, and then adjusting the horizontal positions of the first holding unit and the second holding unit with the moving mechanism.

15. The bonding method of claim 11, wherein the first holding unit, the second holding unit, the moving mechanism, the first image pickup unit and the second image pickup unit are located within a processing vessel, the first holding unit being fixed within the processing vessel, and the moving mechanism being configured to move the second holding unit in the horizontal direction and the vertical direction.