Printed Circuit Board and Manufacture Method Thereof
First Claim
Patent Images
1. A printed circuit board comprising:
- a substrate havingan insulating layer,aluminum foil layers disposed on both sides of the insulating layer, anda through-hole formed in the insulating layer and aluminum foil layers;
a metal layer disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole;
a zinc film positioned on a surface of the aluminum foil;
a metal film disposed over the zinc film;
a plating film disposed on a surface of the metal film; and
a circuit pattern etched through the aluminum foil and the plating film.
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Abstract
A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers. A metal layer is disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole. A zinc film is positioned on a surface of the aluminum foil. A metal film is disposed over the zinc film. A plating film is disposed on a surface of the metal film. A circuit pattern is etched through the aluminum foil and the plating film.
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Citations
24 Claims
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1. A printed circuit board comprising:
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a substrate having an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers; a metal layer disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole; a zinc film positioned on a surface of the aluminum foil; a metal film disposed over the zinc film; a plating film disposed on a surface of the metal film; and a circuit pattern etched through the aluminum foil and the plating film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A manufacturing method for a printed circuit board comprising the steps of:
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(a) preparing an aluminum foil; (b) bonding the aluminum foil to both sides of an insulating layer; (c) forming a through-hole passing through the aluminum foil and the insulating layer; (d) forming a metal layer by depositing metal on an exposed portion of an inner surface of the through-hole on the insulating layer; (e) replacing a surface of the aluminum foil with a zinc (Zn) film; (f) forming a metal film by performing plating with respect to surfaces of the metal layer and the Zn film; and (g) forming a plating film on a surface of the metal film by plating. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification