Bonded Semiconductor Structures
First Claim
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1. A method, comprising:
- forming an epitaxial layer on a first semiconductor substrate;
implanting at least one implant species between the epitaxial layer and the first semiconductor substrate to form an ion-implanted layer;
bonding the epitaxial layer to a bonding oxide layer of a second semiconductor substrate; and
separating the first semiconductor substrate from the ion-implanted layer.
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Abstract
A method is disclosed that includes the steps outlined below. An epitaxial layer is formed on a first semiconductor substrate. At least one implant species is implanted between the epitaxial layer and the first semiconductor substrate to form an ion-implanted layer. The epitaxial layer is bonded to a bonding oxide layer of a second semiconductor substrate. The first semiconductor substrate is separated from the ion-implanted layer.
15 Citations
29 Claims
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1. A method, comprising:
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forming an epitaxial layer on a first semiconductor substrate; implanting at least one implant species between the epitaxial layer and the first semiconductor substrate to form an ion-implanted layer; bonding the epitaxial layer to a bonding oxide layer of a second semiconductor substrate; and separating the first semiconductor substrate from the ion-implanted layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 17, 27)
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13. A method, comprising:
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bonding an epitaxial layer on a first semiconductor substrate to a bonding oxide layer of a second semiconductor substrate, wherein the epitaxial layer and the first semiconductor substrate comprises an ion-implanted layer in between; separating the first semiconductor substrate from the ion-implanted layer; forming a first semiconductor device portion on the epitaxial layer; forming at least one via through the first semiconductor device portion, the epitaxial layer, and the bonding oxide layer; and forming an interconnect layer on the first semiconductor device portion. - View Dependent Claims (14, 15, 16, 28, 29)
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18-26. -26. (canceled)
Specification