PROBE CARD AND METHOD OF MANUFACTURING THE SAME

• US 20150022230A1
• Filed: 07/10/2014
• Published: 01/22/2015
• Est. Priority Date: 07/19/2013
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: FUKASAWA, Ryo, HORIUCHI, Michio, TOKUTAKE, Yasue, MATSUDA, Yuichi, AIZAWA, Mitsuhiro
• Granted Patent: US 9,476,913 B2
• Time in Patent Office: Days
• US Class Current: 324/756.03
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A probe card includes a wiring substrate including an opening portion, a first connection pad, and a second connection pad arranged in an opposite area to the first connection pad, a resin portion formed in the opening portion, a first wire buried in the resin portion, in which one end is connected to the first connection pad and other end constitutes a first contact terminal, and a second wire buried in the resin portion, in which one end is connected to the second connection pad and other end constitutes a second contact terminal, wherein the first and second wires extend on one line, and the first and second contact terminals are arranged on the one line, and the first and second contact terminals are gathered to be separated such that the first and second contact terminals touch one electrode pad of a text object with a pair.

Claims

1. A probe card, comprising:

a wiring substrate including an opening portion;

a first connection pad formed on a first face of the wiring substrate and arranged in one area of a periphery of the opening portion;

a second connection pad formed on the first face of the wiring substrate and arranged in another area of a periphery of the opening portion, the another area which is opposed to the first connection pad;

a resin portion formed in the opening portion of the wiring substrate;

a first wire buried in the resin portion, the first wire in which one end is connected to the first, connection pad and other end constitutes a first contact terminal protruding from a lower face of the resin portion, the lower face which is located to a reverse face side to a face on which the first and second connection pads are arranged; and

a second wire buried in the resin portion, the second wire in which one end is connected to the second connection pad and other end constitutes a second contact terminal protruding from the lower face of the resin portion, wherein

the first wire and the second wire extend on one line in a plan view, and the first contact terminal and the second contact terminal are arranged side by side on the one line, and

the first contact terminal and the second contact terminal are gathered to be separated each other such that the first and second contact terminals touch one electrode pad of a test object with a pair.

2. The probe card according to claim 1, wherein

each diameter of the first contact terminal and the second contact terminal is equal to each diameter of the first wire and the second wire in the resin portion, and

a contact face of a tip of each of the first contact terminal and the second contact terminal is formed as a flat face.

3. The probe card according to claim 1, wherein

a plurality of pairs of wires, each pair formed of the first wire and the second wire, are arranged side by side in parallel in the opening portion of the wiring substrate, and

pairs of contact terminals, each pair formed of the first contact terminal and the second contact terminal, are arranged side by side with one row to a direction perpendicular to an extending direction of the wires.

4. The probe card according to claim 1, wherein

a plurality of pairs of wires, each pair formed of the first wire and the second wire, are arranged side by side in parallel in the opening portion of the wiring substrate, and

pairs of contact terminals, each pair formed of the first contact terminal and the second contact terminal, are arranged with a staggered arrangement to a direction perpendicular to an extending direction of the wires.

5. The probe card according to claim 1, wherein each of the first and second wires is a wire with insulation coating.

6. The probe card according to claim 1, wherein the first and second connection pads and the each one end of the first and second wires are buried in the resin portion.

7. The probe card according to claim 1, wherein the resin portion has a protruding portion protruding downward from a second face of the wiring substrate.