Electronic Module for a Control Unit

• US 20150022976A1
• Filed: 09/04/2012
• Published: 01/22/2015
• Est. Priority Date: 11/08/2011
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Ott, Harald
• Granted Patent: US 9,763,344 B2
• Time in Patent Office: Days
• US Class Current: 361/736
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 5/003 having an integrally preformed housing
• CPC Class Codes: H05K 5/0082 specially adapted for transmission control units, e.g. gearbox controllers
• CPC Class Codes: H05K 5/06 Hermetically-sealed casings specially adapted for small components H05K5/0095

Abstract

An electronic module for a vehicle includes a covering element, a component-carrier printed circuit board element, a carrier element having a first side and a second side, a printed circuit board element, and at least one contact-connection element. The contact-connection element is configured to provide a conductive contact-connection between the component-carrier printed circuit board element and the printed circuit board element. The covering element and component-carrier printed circuit board element are positioned on the first side of the carrier element, and the printed circuit board element is positioned on the second side of the carrier element. The carrier element has at least one opening, and the contact-connection element is led through the opening.

Claims

1. An electronic module for a vehicle, having

a covering element;

a component support printed circuit board element;

a support element having a first side and a second side;

a printed circuit board element; and

at least one contact-making element configured to provide conductive contact between the component support printed circuit board element and the printed circuit board element;

wherein the covering element and the component support printed circuit board element are positioned on the first side of the support element;

wherein the printed circuit board element is positioned on the second side of the support element;

wherein the support element has at least one opening; and

wherein the contact-making element is routed through the opening.

2. The electronic module as claimed in claim 1, wherein the electronic module is of hermetically sealed.

3. The electronic module as claimed in claim 1,

wherein a material of the covering element and a material of the support element have a similar coefficient of thermal expansion.

4. The electronic module as claimed in one of the preceding claims claim 1,

wherein at least one of:

the covering element and the support element are connected by a connection from amongst the group consisting of an adhesive connection, a welded connection, an encapsulated connection, and a rivet connection; and

the printed circuit board element and the support element are connected using an adhesive bond.

5. The electronic module as claimed in claim 1,

wherein the support element has a further opening outside the covering element that is configured to connect a conductor element or a sensor element to the printed circuit board element.

6. The electronic module as claimed in one of the preceding claims claim 1,

wherein the support element has at least one cutout with a sealing element between at least one of:

the support element and the covering element; and

the support element and the printed circuit board element.

7. The electronic module as claimed in claim 1,

wherein the support element and the printed circuit board element each have a respective closable hole in a region inside the covering element.

8. The electronic module as claimed in one of the preceding claims claim 1,

wherein a molded encapsulation is disposed on the support element in a region outside the covering element.

9. A control unit for a vehicle, having an electronic module that includes:

a covering element;

a component support printed circuit board element;

a support element having a first side and a second side;

a printed circuit board element; and

at least one contact-making element configured to provide conductive contact between the component support printed circuit board element and the printed circuit board element;

wherein the covering element and the component support printed circuit board element are positioned on the first side of the support element;

wherein the printed circuit board element is positioned on the second side of the support element;

wherein the support element has at least one opening; and

wherein the contact-making element is routed through the opening.

10. A vehicle, having at least one of:

(i) an electronic module that includes;

a covering element;

a component support printed circuit board element;

a support element having a first side and a second side;

a printed circuit board element; and

at least one contact-making element configured to provide conductive contact between the component support printed circuit board element and the printed circuit board element;

wherein the covering element and the component support printed circuit board element are positioned on the first side of the support element;

wherein the printed circuit board element is positioned on the second side of the support element;

wherein the support element has at least one opening; and

wherein the contact-making element is routed through the opening; and

(ii) a control unit that includes the electronic module.