VAPOR DEPOSITION APPARATUS

• US 20150027371A1
• Filed: 01/23/2014
• Published: 01/29/2015
• Est. Priority Date: 07/25/2013
• Status: Abandoned Application

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Kim, Jin-Kwang, Song, Seung-Yong, Huh, Myung-Soo, Jung, Suk-Won, Jang, Choel-Min, Kim, Jae-Hyun, Kim, Sung-Chul
• Application Number:
  US14/161,984
• Publication Number:
  US 20150027371A1
• Time in Patent Office: Days
• US Class Current: 118/715
• CPC Class Codes: C23C 16/45536 Use of plasma, radiation or electromagnetic fields
• CPC Class Codes: C23C 16/45551 for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
• CPC Class Codes: C23C 16/45574 Nozzles for more than one gas

Abstract

A vapor deposition apparatus for providing a deposition film on a substrate, the vapor deposition apparatus includes a plurality of first nozzle parts which injects a first raw material toward the substrate; a plurality of second nozzle parts which is alternately disposed together with the plurality of first nozzle parts and injects a second raw material toward the substrate; a diffuser unit which distributes the second raw material to the plurality of second nozzle parts; and a supply unit which supplies the second raw material to the diffuser unit.

Claims

1. A vapor deposition apparatus which provides a deposition film on a substrate, the vapor deposition apparatus comprising:

a plurality of first nozzle parts which injects a first raw material toward the substrate;

a plurality of second nozzle parts which is alternately disposed with the plurality of first nozzle parts and injects a second raw material toward the substrate;

a diffuser unit which distributes the second raw material to the plurality of second nozzle parts; and

a supply unit which supplies the second raw material to the diffuser unit.

2. The vapor deposition apparatus of claim 1,

wherein the diffuser unit comprises an upper plate, a lower plate, and a plurality of distribution plates substantially parallel to one another between the upper plate and the lower plate, and

wherein the plurality of distribution plates is separated from one another.

3. The vapor deposition apparatus of claim 2,

wherein holes through which the second raw material passes are defined in each of the plurality of distribution plates, and

wherein a number of first holes defined in a first distribution plate of the plurality of distribution plates disposed nearer to the supply unit than other distribution plates of the plurality of distribution plates is smaller than a number of second holes defined in a second distribution plate of the plurality of distribution plates disposed nearer to the plurality of second nozzle part than other distribution plates of the plurality of distribution plates.

4. The vapor deposition apparatus of claim 3, wherein a size of each of the first holes is larger than a size of each of the second holes.

5. The vapor deposition apparatus of claim 3, wherein an entire area of the second holes is larger than an entire area of the first holes.

6. The vapor deposition apparatus of claim 2, wherein a plurality of slits corresponding to the plurality of second nozzle parts is defined in the lower plate.

7. The vapor deposition apparatus of claim 2, wherein the plurality of distribution plates is detachably coupled to the diffuser unit.

8. The vapor deposition apparatus of claim 2, further comprising a chamber in which the plurality of first nozzle parts, the plurality of second nozzle parts, the diffuser unit, the supply unit and the substrate are disposed, wherein the diffuser unit is in thermal contact with the chamber.

9. The vapor deposition apparatus of claim 1, further comprising an exhaust unit and a purge unit between the plurality of first nozzle part and the plurality of second nozzle part.

10. The vapor deposition apparatus of claim 1, wherein the supply unit comprises a plasma generation part.

11. The vapor deposition apparatus of claim 1, wherein the substrate moves relative to the vapor deposition apparatus.

12. The vapor deposition apparatus of claim 1, further comprising a deposition unit in which the first and second nozzle parts are defined,

wherein

the first raw material flows in a horizontal direction through the deposition unit to be supplied to the plurality of first nozzle parts, and

the second raw material flows in a perpendicular direction through the deposition unit to be supplied to the plurality of second nozzle parts.

13. A vapor deposition apparatus which provides a deposition film on a substrate, the vapor deposition apparatus comprising:

a deposition unit comprising a plurality of first nozzle parts which injects a first raw material toward the substrate and a plurality of second nozzle parts which is alternately disposed with the plurality of first nozzle parts and injects a second raw material toward the substrate;

a diffuser unit which is coupled with the deposition unit and distributes the second raw material to the plurality of second nozzle parts; and

a supply unit which supplies the second raw material to the diffuser unit,

wherein the diffuser unit comprises an upper plate, a lower plate, and a plurality of distribution plates substantially parallel to one another between the upper plate and the lower plate, and

wherein a plurality of slits corresponding to the plurality of second nozzle parts is defined in the lower plate.

14. The vapor deposition apparatus of claim 13, wherein the plurality of distribution plates is separated from one another, and holes through which the second raw material passes are defined in each of the plurality of distribution plates

15. The vapor deposition apparatus of claim 14, wherein a number of first holes defined in a first distribution plate of the plurality of distribution plates disposed nearer to the supply unit than other distribution plates of the plurality of distribution plates is smaller than a number of second holes defined in a second distribution plate of the plurality of distribution plates disposed nearer to the plurality of second nozzle parts than other distribution plates of the plurality of distribution plates.

16. The vapor deposition apparatus of claim 15, wherein

a size of each of the first holes is larger than a size of each of the second holes, and

an entire area of the second holes is larger than an entire area of the first holes.

17. The vapor deposition apparatus of claim 13, wherein the supply unit comprises a plasma generation part.

18. The vapor deposition apparatus of claim 13, wherein the plurality of distribution plates is detachably coupled to the diffuser unit.

19. The vapor deposition apparatus of claim 13, wherein the deposition unit further comprises an exhaust unit and a purge unit disposed between the plurality of first nozzle parts and the plurality of second nozzle parts.

20. The vapor deposition apparatus of claim 13, wherein

the first raw material flows in a horizontal direction through the deposition unit to be supplied to the plurality of first nozzle parts, and

the second raw material flows in a perpendicular direction through the deposition unit to be supplied to the plurality of second nozzle parts.