Apparatus and Method for a Conductive Elastomer on a Coaxial Cable or a Microcable to Improve Signal Integrity Probing

• US 20150027749A1
• Filed: 10/13/2014
• Published: 01/29/2015
• Est. Priority Date: 03/14/2012
• Status: Active Grant

• Current Assignee: R&D Sockets Incorporated
• Original Assignee: R&D Sockets Incorporated
• Inventors: Warwick, Thomas P., Russell, James V.
• Granted Patent: US 9,685,717 B2
• Time in Patent Office: Days
• US Class Current: 174/135
• CPC Class Codes: H01R 11/18 End pieces terminating in a probe
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 2201/20 for testing or measuring purposes
• CPC Class Codes: H01R 9/05 for coaxial cables
• CPC Class Codes: Y10T 29/49123 Co-axial cable
• CPC Class Codes: Y10T 29/49895 Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]

Abstract

A method and structure for improving signal integrity probing. A coaxial or a microcoaxial cable is threaded through an optional alignment substrate where the cable is used to support or align the cable or an array of cables. A conductive elastomer is placed on a cable or a microcoaxial cable to improve signal integrity probing.

Claims

1. A method for improving signal integrity probing, the steps comprising:

threading a coaxial or a microcoaxial cable through an optional alignment substrate wherein said substrate supports or aligns the cable or an array of cables; and

placing at least one conductive elastomeric pin that is affixed onto an electrically conductive disc that is placed in fixed contact with at least one of a center conductive region of said cable or said microcoaxial cable to improve signal integrity probing.

2. The method for improving signal integrity probing according to claim 1 further comprising forming a pad with a low contact resistance metal, said pad having sharp points or “

aspirates”

formed on top to help penetrate oxides, oils of debris that may form on the subject contact point that is intended to be probed.

3. The method according to claim 2 further comprising forming another pad with a low contact resistance metal having sharp points or “

aspirates”

formed on a bottom side of said substrate to provide for a high speed, high band width connector.

17. The apparatus according to claim 1 wherein said conductive disc is a metallic disc.

4. An apparatus for improving signal integrity probing, comprising:

a coaxial or a microcoaxial cable threaded through an optional alignment substrate wherein said substrate supports or aligns the cable or an array of cables; and

a conductive elastomeric pin that is attached to an electrically conductive disc which is placed in fixed contact with a center conductor region of said cable or said microcoaxial cable to improve signal integrity probing.

5. The apparatus for improving signal integrity probing according to claim 4 wherein said conductive elastomer is placed near a top surface of said substrate.

6. The apparatus for improving signal integrity probing according to claim 4 wherein said conductive elastomer is applied to the center conductor region in a column.

7. The apparatus for improving signal integrity probing according to claim 6 said conductive elastomer is applied in the ground shielding region where the shield of the cable and the top surface of the substrate meet.

8. The apparatus for improving signal integrity probing according to claim 4 wherein said substrate is formed as an electrically conductive metal.

9. The apparatus for improving signal integrity probing according to claim 4 wherein said substrate is formed as an insulator.

10. The apparatus for improving signal integrity probing according to claim 4 wherein said cable has an outer metallic shell that is placed firmly in intimate contact with said substrate to ensure good electrical connection.

11. The apparatus for improving signal integrity probing according to claim 7 wherein said outer metallic shell is soldered to said substrate to ensure good electrical connection.

12. The apparatus for improving signal integrity probing according to claim 4 wherein said cable has a top side that is flush with a top of said substrate.

13. The apparatus for improving signal integrity probing according to claim 4 wherein said cable has a bottom side of the cable that is flush to the bottom and is free to either accept a traditional connector or to be attached to an electronic assembly through any conventional techniques known in the art.

14. The apparatus for improving signal integrity probing according to claim 4 wherein said cable has a bottom that extends outward from the bottom and can be free to either accept a traditional connector or be attached to an electronic assembly through any conventional techniques known in the art.

15. The apparatus for improving signal integrity probing according to claim 4 further comprising low contact resistance metal forms a pad with sharp points or “

aspirates”

formed on top to help penetrate oxides, oils of debris that may form on the subject contact point that is intended to be probed.

16. The apparatus for improving signal integrity probing according to claim 15 wherein a low contact resistance metal forms another pad with sharp points or “

aspirates”

formed on a bottom side of said substrate to provide for a high speed, high band width connector.