ANODE FOR ELECTROPLATING AND METHOD FOR ELECTROPLATING USING ANODE

• US 20150027899A1
• Filed: 08/31/2012
• Published: 01/29/2015
• Est. Priority Date: 09/13/2011
• Status: Active Grant

• Current Assignee: Doshisha Company Limited
• Original Assignee: Doshisha Company Limited
• Inventors: Morimitsu, Masatsugu
• Granted Patent: US 9,556,534 B2
• Time in Patent Office: Days
• US Class Current: 205/265
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 17/10 Electrodes , e.g. composition, counter electrode

Abstract

Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate.

Claims

1. An anode for electroplating used in electroplating which uses an aqueous solution as an electrolytic solution, wherein a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate.

2. The anode for electroplating according to claim 1, wherein the catalytic layer is composed of a mixture of amorphous ruthenium oxide and amorphous tantalum oxide.

3. The anode for electroplating according to claim 1, wherein a mole ratio of ruthenium to tantalum in the catalytic layer is 50:

50.

4. The anode for electroplating according to claim 1, wherein an intermediate layer is formed between the catalytic layer and the conductive substrate.

5. The anode for electroplating according to claim 4, wherein the intermediate layer is made of tantalum, niobium, tungsten, molybdenum, titanium, platinum or any one of alloys of these metals.

6. The anode for electroplating according to claim 4, wherein the intermediate layer contains crystalline iridium oxide and amorphous tantalum oxide.

7. The anode for electroplating according to claim 4, wherein the intermediate layer contains a crystalline composite oxide of ruthenium and titanium.

8. The anode for electroplating according to claim 4, wherein the intermediate layer contains crystalline ruthenium oxide and amorphous tantalum oxide.

9. The anode for electroplating according to claim 4, wherein the intermediate layer is electrically conductive diamond.

10. The anode for electroplating according to claim 1, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

11. A method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 1 is used to electroplate a desired metal.

12. The method for electroplating according to claim 11, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

13. The anode for electroplating according to claim 2, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

14. The anode for electroplating according to claim 3, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

15. The anode for electroplating according to claim 4, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

16. The anode for electroplating according to claim 5, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

17. The anode for electroplating according to claim 6, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

18. The anode for electroplating according to claim 7, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

19. The anode for electroplating according to claim 8, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

20. The anode for electroplating according to claim 9, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

21. The method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 2 is used to electroplate a desired metal.

22. The method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 3 is used to electroplate a desired metal.

23. The method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 4 is used to electroplate a desired metal.

24. The method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 5 is used to electroplate a desired metal.

25. The method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 6 is used to electroplate a desired metal.

26. The method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 7 is used to electroplate a desired metal.

27. The method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 8 is used to electroplate a desired metal.

28. The method for electroplating which uses an aqueous solution as an electrolytic solution, wherein the anode for electroplating according to claim 9 is used to electroplate a desired metal.

29. The method for electroplating according to claim 21, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

30. The method for electroplating according to claim 22, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

31. The method for electroplating according to claim 23, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

32. The method for electroplating according to claim 24, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

33. The method for electroplating according to claim 25, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

34. The method for electroplating according to claim 26, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

35. The method for electroplating according to claim 27, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.

36. The method for electroplating according to claim 28, wherein a metal to be electroplated is any one of copper, zinc, tin, nickel, cobalt, lead, chromium, indium, platinum, silver, iridium, ruthenium and palladium.