×

ADHESIVE WAFER BONDING WITH CONTROLLED THICKNESS VARIATION

  • US 20150028362A1
  • Filed: 07/26/2013
  • Published: 01/29/2015
  • Est. Priority Date: 07/26/2013
  • Status: Active Grant
First Claim
Patent Images

1. A method of forming an array of micro devices comprising:

  • patterning a device layer to form an array of micro device mesa structures over a handle substrate;

    forming a patterned sacrificial layer including an array of openings over the corresponding array of micro device mesa structures;

    forming a stabilization layer over the patterned sacrificial layer and within the array of openings; and

    bonding the stabilization layer to a spacer side of a carrier substrate, wherein the spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×