LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND LIGHT-EMITTING DIODE LIGHT BULB

• US 20150029723A1
• Filed: 04/11/2014
• Published: 01/29/2015
• Est. Priority Date: 07/23/2013
• Status: Abandoned Application

• Current Assignee: Lextar Electronics Corporation
• Original Assignee: Lextar Electronics Corporation
• Inventors: Lo, Shih-Ju, Hsu, Hui-Kai, Chang, Cheng-Ping, Lee, I-Chun, Shao, Wen-Kai
• Application Number:
  US14/251,546
• Publication Number:
  US 20150029723A1
• Time in Patent Office: Days
• US Class Current: 362/293
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/049 Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

The disclosure provides a light-emitting diode (LED) package structure, including: a lead frame; at least two light-emitting diode chips having different light-emitting wavelengths disposed on the lead frame; an encapsulant disposed over the lead frame and covering the light-emitting diode chips, wherein the encapsulant has a first concave portion; and an optical glue disposed in the first concave portion, wherein the optical glue has a plurality of scattering particles to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips.

Claims

1. A light-emitting diode (LED) package structure, comprising:

a lead frame;

at least two light-emitting diode chips having different light-emitting wavelengths disposed on the lead frame;

an encapsulant disposed over the lead frame and covering the light-emitting diode chips, wherein the encapsulant has a first concave portion; and

an optical glue disposed in the first concave portion, wherein the optical glue has a plurality of scattering particles to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips.

2. The light-emitting diode (LED) package structure as claimed in claim 1, further comprises a main body covering the lead frame, and the main body has a cavity recessed inward, wherein a bottom of the cavity exposes a portion of the lead frame to define a die-mount region, the light-emitting diode chips are fixed in the die-mount region, and the encapsulant is filled in the cavity and covers the light-emitting diode chips.

3. The light-emitting diode (LED) package structure as claimed in claim 2, wherein the first concave portion is formed by compression molding or mechanical processing.

4. The light-emitting diode (LED) package structure as claimed in claim 3, wherein the first concave portion comprises a plurality of concave structures recessed into a surface of the encapsulant.

5. The light-emitting diode (LED) package structure as claimed in claim 4, wherein the plurality of concave structures are arranged periodically.

6. The light-emitting diode (LED) package structure as claimed in claim 3, wherein a concentration of the plurality of scattering particles is 5 vol % to 60 vol %.

7. The light-emitting diode (LED) package structure as claimed in claim 6, wherein the encapsulant further comprises a wavelength-conversion material.

8. The light-emitting diode (LED) package structure as claimed in claim 7, wherein the wavelength-conversion material is phosphor.

9. The light-emitting diode (LED) package structure as claimed in claim 3, wherein the at least two light-emitting diode chips having different light-emitting wavelengths are selected from two or all of red light-emitting diode chips, blue light-emitting diode chips, and green light-emitting diode chips.

10. A light-emitting diode (LED) light bulb, comprising:

a lamp base;

a light source module disposed over the lamp base, wherein the light source module comprises a light-emitting diode (LED) package structure, comprising;

a lead frame;

at least two light-emitting diode chips having different light-emitting wavelengths disposed on the lead frame;

an encapsulant disposed over the lead frame and covering the light-emitting diode chips, wherein the encapsulant has a first concave portion; and

a first optical glue disposed in the first concave portion, wherein the first optical glue has a plurality of first scattering particles to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips;

a driving circuit disposed in the lamp base and electrically connecting the light source module; and

a lampshade disposed over the lamp base and covering the light source module.

11. The light-emitting diode (LED) light bulb as claimed in claim 10, wherein the light-emitting diode (LED) package structure further comprises a main body covering the lead frame, and the main body has a cavity recessed inward, wherein a bottom of the cavity exposes a portion of the lead frame to define a die-mount region, the light-emitting diode chips are fixed in the die-mount region, and the encapsulant is filled in the cavity and covers the light-emitting diode chips.

12. The light-emitting diode (LED) light bulb as claimed in claim 11, wherein the first concave portion is formed by compression molding or mechanical processing.

13. The light-emitting diode (LED) light bulb as claimed in claim 12, wherein the first concave portion comprises a plurality of concave structures recessed into a surface of the encapsulant.

14. The light-emitting diode (LED) light bulb as claimed in claim 13, wherein the plurality of concave structures are arranged periodically.

15. The light-emitting diode (LED) light bulb as claimed in claim 12, wherein a concentration of the plurality of first scattering particles is 5 vol % to 60 vol %.

16. The light-emitting diode (LED) light bulb as claimed in claim 15, wherein the encapsulant further comprises a wavelength-conversion material.

17. The light-emitting diode (LED) light bulb as claimed in claim 16, wherein the wavelength-conversion material is phosphor.

18. The light-emitting diode (LED) light bulb as claimed in claim 12, wherein the at least two light-emitting diode chips having different light-emitting wavelengths are selected from two or all of red light-emitting diode chips, blue light-emitting diode chips, and green light-emitting diode chips.

19. The light-emitting diode (LED) light bulb as claimed in claim 12, wherein the lampshade comprises:

a second concave portion formed at a top portion of the lampshade; and

a second optical glue disposed in the second concave portion to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips, wherein the second optical glue has a plurality of second scattering particles.

20. The light-emitting diode (LED) light bulb as claimed in claim 19, wherein a concentration of the plurality of second scattering particles is 5 vol % to 60 vol %, and the plurality of second scattering particles further comprises a wavelength-conversion material.