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Strength of Micro-Bump Joints

  • US 20150037936A1
  • Filed: 10/22/2014
  • Published: 02/05/2015
  • Est. Priority Date: 05/28/2010
  • Status: Active Grant
First Claim
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1. A method of forming a device, the method comprising:

  • forming a metal bump on a first work piece;

    forming a dielectric layer over and contacting the metal bump;

    forming an opening in the dielectric layer to expose a portion of the metal bump;

    etching the portion of the metal bump exposed through the opening to form a recess, a portion of the recess extending to directly under the dielectric layer; and

    forming a metal finish on the metal bump, with at least a portion of the metal finish formed in the recess.

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