COMPONENT MOUNTING MACHINE

• US 20150040384A1
• Filed: 02/28/2012
• Published: 02/12/2015
• Est. Priority Date: 02/28/2012
• Status: Active Grant

• Current Assignee: Fuji Company Limited
• Original Assignee: Fuji Machine Manufacturing Company Limited
• Inventors: Nishiyama, Satoru, Okada, Takehito
• Granted Patent: US 9,844,170 B2
• Time in Patent Office: Days
• US Class Current: 29/739
• CPC Class Codes: H05K 13/04 Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 13/041 having multiple pick-up tools
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0853 Determination of transport trajectories inside mounting machines
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate

Abstract

When a mounting head is moved upward of a rear side conveyor across and over a front side conveyor after a component suction operation, it is determined whether or not there is a possibility that a component sucked by a suction nozzle may interfere with a component mounted on a circuit board on the front side conveyor. When so determined, a head lifting mechanism is caused to lift up the mounting head to a position where the component sucked by the suction nozzle does not interfere with the mounted component. Thereafter, the mounting head is moved upward of the rear side conveyor, and the head lifting mechanism is caused to lower down the mounting head to an initial height position. Thereafter, the component is mounted on a circuit board on the rear side conveyor.

Claims

1. A component mounting machine comprising:

a mounting head that holds a plurality of suction nozzles;

a plurality of conveyors disposed in parallel to transport a plurality of circuit boards in parallel;

a head driving device that moves the mounting head across the plurality of conveyors and mounts a component sucked by a suction nozzle of the plurality of suction nozzles on to the circuit boards transported by each conveyor; and

a control device that controls the plurality of conveyors and the head driving device,

wherein the head driving device has a nozzle lifting mechanism which individually lifts up and down the plurality of suction nozzles during component suction and component mounting, and an XY moving mechanism which moves the mounting head in an XY direction,

wherein the head driving device has a head lifting mechanism which lifts up and down the mounting head,

wherein when the control device causes the XY moving mechanism to move the mounting head across the plurality of conveyors after a component suction operation and there is a possibility that the component sucked by the suction nozzle may interfere with a mounted component on the circuit board on any of the plurality of conveyors, the control device causes the head lifting mechanism to lift up the mounting head to a height position where the component sucked by the suction nozzle does not interfere with the mounted component, wherein thereafter, the control device causes the XY moving mechanism to move the mounting head upward of a target conveyor, and causes the head lifting mechanism to lower down the mounting head to an initial height position, and wherein thereafter, the control device causes the nozzle lifting mechanism to lower down the suction nozzle and to mount the component on the circuit board on the conveyor.

2. The component mounting machine according to claim 1,

wherein the mounting head is a rotary-type mounting head in which the plurality of suction nozzles is arrayed at a predetermined interval in a circumferential direction of the mounting head and which has a lifting lever for respectively lifting-up and down each of the suction nozzles,

wherein the head driving device has a head rotating mechanism which rotates the mounting head, and the nozzle lifting mechanism engages with the lifting lever to individually lift up and down the plurality of suction nozzles during the component suction operation and a component mounting operation, and

wherein when causing the head lifting mechanism to lift up the mounting head, the control device causes the head rotating mechanism to rotate the mounting head to move to a position where the lifting lever does not interfere with the nozzle lifting mechanism, and thereafter, the control device causes the head lifting mechanism to lift up the mounting head.

3. The component mounting machine according to claim 1,

wherein the head lifting mechanism includes a ball screw mechanism which lifts up and lowers down the mounting head, and a motor which drives the ball screw mechanism, and the head lifting mechanism steplessly adjusts the height position of the mounting head, and

wherein when causing the head lifting mechanism to lift up the mounting head, the control device causes the head lifting mechanism to lift up the mounting head to the minimum height position where the component sucked by the suction nozzle does not interfere with the mounted component.

4. The component mounting machine according to claim 1, wherein when causing the XY moving mechanism to move the mounting head across the plurality of conveyors after the component suction operation, the control device determines whether or not there is a possibility that the component sucked by the suction nozzle may interfere with the component mounted on the circuit board on any conveyor based on a height position of the component sucked by the suction nozzle and a height position of the mounted component present below a moving route of the mounting head.

5. The component mounting machine according to claim 2,

wherein the head lifting mechanism includes a ball screw mechanism which lifts up and lowers down the mounting head, and a motor which drives the ball screw mechanism, and the head lifting mechanism steplessly adjusts the height position of the mounting head, and

wherein when causing the head lifting mechanism to lift up the mounting head, the control device causes the head lifting mechanism to lift up the mounting head to the minimum height position where the component sucked by the suction nozzle does not interfere with the mounted component.

6. The component mounting machine according to claim 2, wherein when causing the XY moving mechanism to move the mounting head across the plurality of conveyors after the component suction operation, the control device determines whether or not there is a possibility that the component sucked by the suction nozzle may interfere with the component mounted on the circuit board on any conveyor based on a height position of the component sucked by the suction nozzle and a height position of the mounted component present below a moving route of the mounting head.

7. The component mounting machine according to claim 3, wherein when causing the XY moving mechanism to move the mounting head across the plurality of conveyors after the component suction operation, the control device determines whether or not there is a possibility that the component sucked by the suction nozzle may interfere with the component mounted on the circuit board on any conveyor based on a height position of the component sucked by the suction nozzle and a height position of the mounted component present below a moving route of the mounting head.

8. A component mounting machine comprising:

a mounting head that holds a plurality of suction nozzles;

a plurality of conveyors disposed in parallel to transport a plurality of circuit boards in parallel;

a head driving device that moves the mounting head across the plurality of conveyors and mounts a component sucked by a suction nozzle of the plurality of suction nozzles on to the circuit boards transported by each conveyor, the head driving device including nozzle lifting mechanism which individually lifts up and down the plurality of suction nozzles during component suction and component mounting, an XY moving mechanism which moves the mounting head in an XY direction, and a head lifting mechanism which lifts up and down the mounting head; and

means for controlling the plurality of conveyors and the head driving device, so that when the XY moving mechanism moves the mounting head across the plurality of conveyors after a component suction operation and there is a possibility that the component sucked by the suction nozzle may interfere with a mounted component on the circuit board on any of the plurality of conveyors, the head lifting mechanism lifts up the mounting head to a height position where the component sucked by the suction nozzle does not interfere with the mounted component, thereafter, the XY moving mechanism moves the mounting head upward of a target conveyor, and the head lifting mechanism lowers down the mounting head to an initial height position, and thereafter, the nozzle lifting mechanism lowers down the suction nozzle and to mount the component on the circuit board on the conveyor.