SYSTEMS AND METHODS FOR ROBUST AND MODULAR SYNTHETIC JET COOLING
First Claim
1. A modular synthetic cooling jet apparatus for cooling at least one electronic component comprising a first synthetic cooling jet, said first synthetic cooling jet comprising:
- a first piezoelectric element;
a first pair of plates coupled to said first piezoelectric element, wherein said first pair of plates comprises a first top plate and a first bottom plate;
a first air gap defined between said first top plate and said first bottom plate; and
a first flex circuit coupled to said first piezoelectric element, said first flex circuit configured to be coupled to an electrical power source and to transmit a first electrical signal to said first piezoelectric element, wherein said first piezoelectric element is configured to actuate at least one of said first top plate and said first bottom plate to induce a first expelling air stream.
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Accused Products
Abstract
A modular synthetic cooling jet apparatus for cooling at least one electronic component and including a first synthetic cooling jet is provided. The first synthetic cooling jet includes a first piezoelectric element, and a first pair of plates coupled to the first piezoelectric element. The first pair of plates includes a first top plate and a first bottom plate. The first synthetic cooling jet also includes a first air gap defined between the first top plate and the first bottom plate. The first flex circuit is coupled to the first piezoelectric element. The first flex circuit is configured to be coupled to an electrical power source and to transmit a first electrical signal to the first piezoelectric element. The first piezoelectric element is configured to actuate at least one of the first top plate and the first bottom plate to induce a first expelling air stream.
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Citations
20 Claims
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1. A modular synthetic cooling jet apparatus for cooling at least one electronic component comprising a first synthetic cooling jet, said first synthetic cooling jet comprising:
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a first piezoelectric element; a first pair of plates coupled to said first piezoelectric element, wherein said first pair of plates comprises a first top plate and a first bottom plate; a first air gap defined between said first top plate and said first bottom plate; and a first flex circuit coupled to said first piezoelectric element, said first flex circuit configured to be coupled to an electrical power source and to transmit a first electrical signal to said first piezoelectric element, wherein said first piezoelectric element is configured to actuate at least one of said first top plate and said first bottom plate to induce a first expelling air stream. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of cooling an electronic component, said method comprising:
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receiving electrical power from an electrical power source at a first flex circuit of a first synthetic cooling jet; transmitting a first electrical signal from the first flex circuit to a first piezoelectric element, wherein the first piezoelectric element is coupled to a first pair of plates that comprise a first top plate and a first bottom plate, the first top plate and the first bottom plate defining a first air gap between the first top plate and the first bottom plate; actuating at least one of the first top plate and the first bottom plate with the first piezoelectric element to induce a first expelling air stream; and facilitating cooling the electronic component with the first expelling air stream. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A synthetic cooling jet system comprising:
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an electrical power source; an electronic component; and a first synthetic cooling jet comprising; a first piezoelectric element; a first pair of plates coupled to said first piezoelectric element, wherein said first pair of plates comprises a first top plate and a first bottom plate; a first air gap defined between said first top plate and said first bottom plate; and a first flex circuit coupled to said first piezoelectric element, the first flex circuit configured to be coupled to said electrical power source and to transmit a first electrical signal to said first piezoelectric element, wherein said first piezoelectric element is configured to actuate at least one of said first top plate and said first bottom plate to induce a first expelling air stream that interacts with said electronic component. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification