WAFER ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
First Claim
1. A microelectromechanical device comprising:
- a first substrate;
a chamber;
a microelectromechanical structure at least partially disposed within the chamber and formed, at least in part, from a first portion of the first substrate;
a second substrate, connected to the first substrate, and having a first surface that forms a wall of the chamber; and
a contact having first and second portions, the first portion of the contact being at least partially disposed outside the chamber and formed, at least in part from a second portion of the first substrate, and the second portion of the contact being formed, at least in part from a portion of the second substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while the second portion of the substrate is disposed at least partly within the cavity and constitutes a first portion of an electrical contact. A second substrate is secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure. The second substrate has a first portion that constitutes a second portion of the electrical contact and is disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber.
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Citations
20 Claims
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1. A microelectromechanical device comprising:
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a first substrate; a chamber; a microelectromechanical structure at least partially disposed within the chamber and formed, at least in part, from a first portion of the first substrate; a second substrate, connected to the first substrate, and having a first surface that forms a wall of the chamber; and a contact having first and second portions, the first portion of the contact being at least partially disposed outside the chamber and formed, at least in part from a second portion of the first substrate, and the second portion of the contact being formed, at least in part from a portion of the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of fabricating a microelectromechanical device, the method comprising:
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forming a microelectromechanical structure within a first substrate, including forming a cavity within the first substrate, and forming trenches within the first substrate to separate first and second portions of the first substrate from each other and from one or more remaining portions of the first substrate, the first portion of the first substrate being disposed within the cavity and constituting the microelectromechanical structure, and the second portion of the substrate being disposed at least in part within the cavity and constituting a first portion of an electrical contact; and securing a second substrate to the first substrate over the cavity to define a chamber containing the microelectromechanical structure, the second substrate having a first portion that constitutes a second portion of the electrical contact, the first portion of the second substrate being disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber and is formed partly from each of the first and second substrates. - View Dependent Claims (12, 13, 14, 16, 17, 18, 19)
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15. The method of claim 15 further comprising disposing a first insulating material within the trench formed around the first portion of the second substrate to electrically isolate the second portion of the electrical contact from the one or more remaining portions of the second substrate.
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20. A microelectromechanical device comprising:
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a first substrate having a cavity formed therein and trenches to separate first and second portions of the first substrate from each other and from one or more remaining portions of the first substrate, the first portion of the first substrate being disposed within the cavity and constituting a microelectromechanical structure, and the second portion of the first substrate being disposed at least in part within the cavity and constituting a first portion of an electrical contact; and a second substrate secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure, the second substrate having a first portion that constitutes a second portion of the electrical contact, the first portion of the second substrate being disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber and is formed partly from each of the first and second substrates.
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Specification