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Alignment Systems and Wafer Bonding Systems and Methods

  • US 20150044786A1
  • Filed: 08/09/2013
  • Published: 02/12/2015
  • Est. Priority Date: 08/09/2013
  • Status: Active Grant
First Claim
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1. An alignment system for a wafer bonding system, the alignment system comprising:

  • means for monitoring an alignment of a first wafer and a second wafer;

    means for adjusting a position of the second wafer; and

    means for feeding back a relative position of the first wafer and the second wafer to the means for adjusting the position of the second wafer before and during a bonding process for the first wafer and the second wafer.

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