SPUTTERING TARGET WITH BACKSIDE COOLING GROOVES

• US 20150047975A1
• Filed: 08/11/2014
• Published: 02/19/2015
• Est. Priority Date: 08/14/2013
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: WEST, Brian T., COX, Michael S., OH, Jeonghoon
• Granted Patent: US 9,779,920 B2
• Time in Patent Office: Days
• US Class Current: 204/298.07
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: H01J 37/3405 Magnetron sputtering
• CPC Class Codes: H01J 37/3423 Shape
• CPC Class Codes: H01J 37/3426 Material
• CPC Class Codes: H01J 37/3429 Plural materials
• CPC Class Codes: H01J 37/3435 Target holders (includes backing plates and endblocks)
• CPC Class Codes: H01J 37/347 Thickness uniformity of coated layers or desired profile of target erosion
• CPC Class Codes: H01J 37/3491 Manufacturing of targets
• CPC Class Codes: H01J 37/3497 Temperature of target

Abstract

Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.

Claims

1. A sputtering target for a sputtering chamber, the sputtering target comprising:

a sputtering plate with a backside surface having radially inner, middle and outer regions, the backside surface having;

a plurality of circular grooves which are spaced apart from one another; and

at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of the sputtering plate; and

an annular-shaped backing plate mounted to the sputtering plate, wherein the annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.

2. The sputtering target of claim 1, wherein the circular grooves are concentric grooves.

3. The sputtering target of claim 2, wherein the circular grooves comprises from about 20 to about 30 grooves.

4. The sputtering target of claim 1, wherein all of the circular grooves are located at the radially middle region of the backside surface.

5. The sputtering target of claim 1, wherein the backside surface has at least 8 arcuate channels.

6. The sputtering target of claim 5, wherein the arcuate channels are spaced apart from one another by an angle of from about 30 to about 90 degrees as measured from the center of the backside surface.

7. The sputtering target of claim 1, wherein the backing plate comprises an alloy of copper and chrome.

8. The sputtering target of claim 1, wherein the backing plate comprises a material selected from Al_0.5Cu, Al_1.0Si, Al_0.5Cu_1.0Si, pure aluminum, copper, chrome, titanium, tungsten, molybdenum, cobalt, tantalum, Li—

P—

O—

N, germanium, GeS₂, silicon, SiO₂, quartz, and combinations thereof.

9. The sputtering target of claim 8 wherein the sputtering plate is composed of titanium or titanium nitride.

10. The sputtering target of claim 1, further comprising a heat exchanger housing capable of holding a heat transfer fluid about the backside surface of the sputtering plate, and a plurality of rotatable magnets within the housing.

11. A sputtering chamber, comprising:

a sputtering target mounted in the sputtering chamber, comprising;

a sputtering plate with a backside surface having radially inner, middle and outer regions, the backside surface having;

a plurality of circular grooves which are spaced apart from one another; and

at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate; and

an annular-shaped backing plate mounted to the sputtering plate, wherein the annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate;

a substrate support facing the sputtering target;

a gas distributor to introduce a gas into the sputtering chamber;

a gas energizer to energize the gas to form a plasma to sputter the sputtering target; and

a gas exhaust port to exhaust gas from the sputtering chamber.

12. The sputtering chamber of claim 11, wherein the circular grooves are concentric grooves.

13. The sputtering chamber of claim 12 wherein all the circular grooves are located at the radially middle region of the backside surface.

14. The sputtering chamber of claim 11 wherein the backside surface has at least about 8 arcuate channels.

15. The sputtering chamber of claim 11 wherein the arcuate channels are spaced apart from one another by an angle of from about 30 to about 90 degrees as measured from the center of the backside surface.

16. A magnetron sputtering target assembly for a sputtering chamber, the sputtering target assembly comprising:

(a) a heat exchanger housing capable of holding heat transfer fluid about a plurality of rotatable magnets;

(b) a sputtering target abutting the housing such that the heat transfer fluid contacts a backside surface of the sputtering target, the sputtering target comprising a backing plate having the backside surface, the backside surface including;

(i) radially inner, middle and outer regions, wherein the radially middle region has a plurality of concentric circular grooves located at the backside surface, and

(ii) a plurality of arcuate channels extending from the radially inner region to the radially outer region of the backside surface; and

(c) a sputtering plate mounted on the front surface of the backing plate wherein at least one of the backing plate and the sputtering plate comprise a material selected from Al0.5Cu, Al1.0Si, Al0.5Cu1.0Si, pure aluminum, copper, chrome, titanium, tungsten, molybdenum, cobalt, tantalum, Li—

P—

O—

N, germanium, GeS₂, silicon, SiO₂, quartz, combinations thereof and alloys thereof.

17. The magnetron sputtering target assembly of claim 16 wherein the circular grooves are from about 20 to about 30 grooves and wherein the backside surface has at least about 8 arcuate channels.

18. The magnetron sputtering target assembly of 17, wherein the at least one arcuate channel comprises at least about 8 channels which are spaced apart from one another by an angle of from about 30 to about 90 degrees as measured from the center of the backside surface.

19. The magnetron sputtering target assembly of 16, wherein the backing plate comprises an alloy of copper and chrome and the sputtering plate is composed of titanium or titanium nitride.

20. The magnetron sputtering target assembly of 17, wherein the circular grooves are concentric grooves.