PACKAGE DEVICE FOR MICROELECTROMECHANICAL INERTIAL SENSOR

• US 20150048463A1
• Filed: 08/16/2013
• Published: 02/19/2015
• Est. Priority Date: 08/16/2013
• Status: Abandoned Application

• Current Assignee: TXC Corporation
• Original Assignee: TXC Corporation
• Inventors: CHIANG, CHIEN-WEI
• Application Number:
  US13/968,830
• Publication Number:
  US 20150048463A1
• Time in Patent Office: Days
• US Class Current: 257/417
• CPC Class Codes: B81B 2201/0228 Inertial sensors
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A package device for a microelectromechanical inertial sensor comprises a ceramic substrate having an upper accommodation space and a lower accommodation and having a plurality of interconnect metal lines thereinside; a microelectromechanical system (MEMS) chip mounted inside the upper accommodation of the ceramic substrate and electrically connected with the interconnect metal lines; a top cover arranged on the ceramic substrate and sealing the upper accommodation space; and an integrated circuit (IC) chip mounted inside the lower accommodation space and electrically connected with the interconnect metal lines. The present invention can improve the reliability of components, increase the yield and decrease the fabrication cost.

Claims

1. A package device for a microelectromechanical inertial sensor, comprising

a ceramic substrate having an upper accommodation space and a lower accommodation and having a plurality of interconnect metal lines thereinside;

a microelectromechanical system (MEMS) chip having at least one microelectromechanical component, mounted inside said upper accommodation of said ceramic substrate and electrically connected with said interconnect metal lines;

a top cover arranged on said ceramic substrate and sealing said upper accommodation space; and

an integrated circuit (IC) chip mounted inside said lower accommodation space and electrically connected with said interconnect metal lines.

2. The package device for a microelectromechanical inertial sensor according to claim 1, wherein said ceramic substrate is an H-shaped substrate, and wherein said MEMS chip is mounted in said upper accommodation space in a flip-chip method, and wherein said IC chip is mounted in said lower accommodation space in a flip-chip method.

3. The package device for a microelectromechanical inertial sensor according to claim 2, wherein said ceramic substrate is formed via stacking a plurality of layers of substrates.

4. The package device for a microelectromechanical inertial sensor according to claim 2, wherein said microelectromechanical system (MEMS) chip electrically connected with said interconnect metal lines by a plurality of first electric-conduction bumps or first bonding wires.

5. The package device for a microelectromechanical inertial sensor according to claim 4, wherein said integrated circuit (IC) chip mounted inside said lower accommodation space and electrically connected with said interconnect metal lines by a plurality of second electric-conduction bumps or second bonding wires.

6. The package device for a microelectromechanical inertial sensor according to claim 1, wherein said top cover is a metallic top cover.

7. The package device for a microelectromechanical inertial sensor according to claim 1, wherein said upper accommodation space is hermetic sealed to have a vacuum state.

8. The package device for a microelectromechanical inertial sensor according to claim 1 further comprising a plurality of electric-conduction pads arranged on a bottom surface of said ceramic substrate and electrically connected with said interconnect metal lines to function as contact points for external communication.

9. The package device for a microelectromechanical inertial sensor according to claim 1, wherein said ceramic substrate is made of a high-temperature co-fired multilayer ceramic or a low-temperature co-fired multilayer ceramic.

10. The package device for a microelectromechanical inertial sensor according to claim 6, wherein a metallic ring is arranged between said ceramic substrate and said top cover.