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PACKAGE DEVICE FOR MICROELECTROMECHANICAL INERTIAL SENSOR

  • US 20150048463A1
  • Filed: 08/16/2013
  • Published: 02/19/2015
  • Est. Priority Date: 08/16/2013
  • Status: Abandoned Application
First Claim
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1. A package device for a microelectromechanical inertial sensor, comprisinga ceramic substrate having an upper accommodation space and a lower accommodation and having a plurality of interconnect metal lines thereinside;

  • a microelectromechanical system (MEMS) chip having at least one microelectromechanical component, mounted inside said upper accommodation of said ceramic substrate and electrically connected with said interconnect metal lines;

    a top cover arranged on said ceramic substrate and sealing said upper accommodation space; and

    an integrated circuit (IC) chip mounted inside said lower accommodation space and electrically connected with said interconnect metal lines.

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