PRINTED CIRCUIT BOARD AND POWER SUPPLY DEVICE

• US 20150048917A1
• Filed: 08/12/2014
• Published: 02/19/2015
• Est. Priority Date: 08/13/2013
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: UCHIYAMA, Tomohiko, MURAI, Yasuhiro
• Granted Patent: US 9,788,410 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 2027/2819 Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A′ and 95B′ within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.

Claims

1. A printed circuit board having a conductive pattern formed on at least one surface of a substrate comprised of an insulation material,

wherein the conductive pattern has a surface-shaped exposure area comprising a connection area thermally connected to a heat radiating member, and

a covered area where a cover layer is formed on a surface of an area other than the connection area.

2. The printed circuit board according to claim 1,

a magnetic core comprising a flat plate portion and a leg portion, and interposes the printed circuit board,

wherein the printed circuit board has an open hole portion, which the leg portion of the magnetic core is inserted into,

the surface-shaped exposure area corresponds to a coil pattern formed around the open hole portion, and

the cover layer formed at a location corresponding to the flat plate portion of the magnetic core when the magnetic core interposes the printed circuit board.

3. The printed circuit board according to claim 1, wherein a thickness of a conductor forming the surface-shaped exposure area is smaller than two times a thickness of the cover layer.

4. The printed circuit board according to claim 1, wherein a dummy portion comprising a surface-shaped conductive pattern and a cover layer formed on the surface of the conductive pattern, is additionally provided in an area other than the surface-shaped exposure area within the one surface of the substrate.

5. A power supply device comprising:

the printed circuit board set forth in of claim 1; and

a housing for accommodating the printed circuit board,

wherein the surface-shaped exposure area is installed on a lower surface of the printed circuit board, the surface-shaped exposure area is thermally connected to the housing, and a bottom surface of the housing functions as the heat radiating member.