LED ILLUMINATION MODULE

• US 20150049486A1
• Filed: 03/14/2013
• Published: 02/19/2015
• Est. Priority Date: 03/14/2012
• Status: Abandoned Application

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Jung, Jung Hwa, Kim, Eun Ju, Jung, Seoung Ho
• Application Number:
  US14/385,231
• Publication Number:
  US 20150049486A1
• Time in Patent Office: Days
• US Class Current: 362/260
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 13/02 Combinations of only two kinds of elements
• CPC Class Codes: F21V 17/12 by screwing
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21V 7/0091 using total internal reflection
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/52 Encapsulations

Abstract

Provided is a light emitting diode (LED) illumination module. The LED illumination module includes a fluorescent substance plate mounted to be capable of being attached to and detached from an opening formed in a top surface of a heat sink. Also, the LED illumination module includes a lens that covers the opening of the heat sink and is mounted to be capable of being attached to and detached from the heat sink.

Claims

1. A light emitting diode (LED) illumination module, comprising:

a heat sink comprising an opening in a top surface of the heat sink and a recess unit formed in a bottom surface of the opening, the recess unit having a smaller width than the opening;

an LED package comprising an LED chip disposed within the recess unit;

a fluorescent substance plate detachably disposed in the opening; and

a lens covering the opening and disposed on the heat sink.

2. The LED illumination module of claim 1, wherein the LED chip is spaced from the fluorescent substance plate.

3. The LED illumination module of claim 2, wherein the distance between the LED chip and the fluorescent substance plate is defined by a depth of the recess unit.

4. The LED illumination module of claim 1, further comprising an optical plate detachably disposed in the opening.

5. The LED illumination module of claim 4, wherein the optical plate comprises a light diffuser plate or a dichroic filter.

6. The LED illumination module of claim 1, wherein the lens is detachably disposed on the heat sink.

7. The LED illumination module of claim 6, wherein:

a groove unit corresponding to an outer circumferential shape of the heat sink is formed in a lower portion of the lens; and

the heat sink is disposed in the groove unit.

8. The LED illumination module of claim 6, wherein the lens is spirally connected with the heat sink.

9. The LED illumination module of claim 6, wherein:

an insertion groove is formed in a bottom surface of the lens or a top surface of the heat sink;

an insertion protrusion is formed in the bottom surface of the lens or the top surface of the heat sink, opposite to the insertion groove; and

the insertion groove and the insertion protrusion are detachably connected.

10. The LED illumination module of claim 1, wherein a central portion of the lens comprises a total reflection surface having a V sectional shape.

11. The LED illumination module of claim 1, wherein the LED package comprises:

an LED chip disposed on a circuit substrate disposed in the recess unit; and

an encapsulation unit covering the LED chip.

12. The LED illumination module of claim 8, wherein:

a screw groove corresponding to an inner circumferential edge of the lens is formed on an upper portion of the heat sink;

a screw protrusion corresponding to an outer circumferential edge of the heat sink is formed on a lower portion of the lens; and

the screw groove and the screw protrusion are detachably connected.