Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly

• US 20150050893A1
• Filed: 08/15/2013
• Published: 02/19/2015
• Est. Priority Date: 08/15/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Nickel, Joshua G., Chen, Chun-Lung, Merz, Nicholas G., Schlub, Robert W., Shiu, Boon W., Yang, Tseng-Mau, Tong, Erica J.
• Granted Patent: US 9,404,842 B2
• Time in Patent Office: Days
• US Class Current: 455/67.14
• CPC Class Codes: G01N 19/04 Measuring adhesive force between materials, e.g. of sealing tape, of coating
• CPC Class Codes: G01N 3/08 by applying steady tensile or compressive forces G01N3/28 takes precedence
• CPC Class Codes: G01N 3/24 by applying steady shearing forces G01N3/26, G01N3/28 take precedence
• CPC Class Codes: G01N 3/56 Investigating resistance to wear or abrasion
• CPC Class Codes: H04B 17/16 Test equipment located at the transmitter

Abstract

Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.

Claims

1. A method for using a test system to characterize device structures under test, where the test system includes a test unit and a test fixture, the method comprising:

activating adhesive material in the device structures under test;

once the adhesive material has been activated, applying stress to the device structures under test with the test fixture; and

while the stress is applied to the device structures under test, gathering test data on the device structures under test with the test unit.

2. The method defined in claim 1, wherein activating the adhesive material comprises applying pressure to the adhesive material.

3. The method defined in claim 1, wherein the adhesive material comprises a pressure-sensitive adhesive.

4. The method defined in claim 1, wherein gathering the test data on the device structures under test comprises gathering scattering parameter measurements on the device structures under test.

5. The method defined in claim 1, wherein activating the adhesive material comprises applying a first type of stress to the device structures under test.

6. The method defined in claim 5, wherein applying the stress to the device structures under test further comprises applying a second type of stress that is different than the first type of stress to the device structures under test.

7. The method defined claim 1, wherein applying the stress to the device structures under test comprises applying different amounts of stress to the device structures under test.

8. A method for using a test system to characterize device structures under test, where the test system includes a test unit and a test fixture, the method comprising:

with the test fixture, applying tensile stress to the device structures under test; and

while the tensile stress is applied to the device structures under test, gathering test data on the device structures under test with the test unit.

9. The method defined in claim 8, further comprising:

applying compressive stress to the device structures under test.

10. The method defined in claim 8, wherein the device structures under test include a conductive material, the method further comprising:

analyzing the gathered test data to determine whether the conductive material satisfies design criteria.

11. The method defined in claim 8, wherein the device structures under test includes an adhesive material, the method further comprising:

determining whether the adhesive material exhibits any defects by analyzing the gathered test data.

12. The method defined in claim 8, wherein gathering the test data comprises gathering reflection coefficient measurements on the device structures under test.

13. The method defined in claim 8, wherein gathering the test data comprises gathering multiport scattering parameter measurements on the device structures under test.

14. The method defined in claim 8, wherein applying the tensile stress comprises increasing the applied tensile stress at regular increments.

15. A test system, comprising:

a test fixture that is configured to receive device structures under test and that is configured to apply tensile stress on device structures under test while the device structures under test are received within the test fixture; and

a test unit configured to gather test data on the device structures under test.

16. The test system defined in claim 15, wherein the test fixture is further configured to activate an adhesive material in the device structures under test while the device structures under test are received within the test fixture.

17. The test system defined in claim 15, further comprising:

a test probe that receives radio-frequency test signals from the test unit and that is coupled to the device structures under test.

18. The test system defined in claim 17, wherein the test probe comprises a signal conductor and a ground conductor, and wherein the device structures under test are interposed between the signal conductor and the ground conductor while the device structures under test are received within the test fixture.

19. The test system defined in claim 15, further comprising:

a radio-frequency cable having a first end that is coupled to the test unit and a second end that is mated to a corresponding coaxial cable in the device structures under test via a radio-frequency coaxial test connector.

20. The test system defined in claim 15, wherein the test unit comprises a radio-frequency tester operable to gather scattering parameter measurements on the device structures under test.