AUTOMATIC OPTICAL APPEARANCE INSPECTION BY LINE SCAN APPARATUS

• US 20150051860A1
• Filed: 08/19/2013
• Published: 02/19/2015
• Est. Priority Date: 08/19/2013
• Status: Abandoned Application

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: ZUO, Kewei, WANG, Chien Rhone, LEE, Hsin-Hui, CHANG, Wen-Yao, SU, Ming-Shin, LIN, Chih-Hao
• Application Number:
  US13/969,630
• Publication Number:
  US 20150051860A1
• Time in Patent Office: Days
• US Class Current: 702/82
• CPC Class Codes: G01N 2021/1774 Line array detector
• CPC Class Codes: G01N 2021/1776 Colour camera
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95684 Patterns showing highly reflecting parts, e.g. metallic elements
• CPC Class Codes: G07C 3/14 Quality control systems

Abstract

A method of inspecting a structure of a device and a system for doing the same is described. The method includes generating a sample image of a device having a structure to be inspected; identifying a plurality of features of the sample image; comparing the plurality of features to a corresponding plurality of features of a reference image; and locating features in the sample image that deviate from corresponding features of the reference image. The generating step includes moving the device, a detector array or both, relative to one another, wherein the detector array is configured to generate a line of data representing light reflected from the device, and assembling lines of data from the detector array to generate a sample image.

Claims

1. A quality assurance system, comprising:

a stage configured to support a device;

a detector array spaced apart from said stage, the detector array configured to generate a line of data representing light reflected from the device;

a drive configured to move said stage, said detector array or both relative to one another;

a processor operatively connected to said detector array, wherein said processor is programmed to;

generate a sample image of the device on said stage from lines of data received from said detector array,

compare a plurality of features of said sample image to a corresponding plurality of features of a reference image, and

detect features in said sample image deviating from corresponding features of the reference image based on the comparison.

2. The quality assurance system as in claim 1, wherein said processor comprises circuitry for pre-processing said sample image prior to making said comparison.

3. The quality assurance system as in claim 1, wherein said processor comprises circuitry for classifying each deviating feature by a type of defect according to a predetermined classification system.

4. The quality assurance system as in claim 3, wherein said predetermined classification system includes defect classifications selected from the group consisting of feature area, feature aspect ratio, RGB color, feature position, boundary region length, roundness of feature, major axis length and minor axis length.

5. The quality assurance system as in claim 1, further comprising a computer readable storage medium operably connected to said processor, wherein said storage medium stores said reference image.

6. The quality assurance system as in claim 1, wherein said processor comprises imaging circuitry for creating an output image comprising said sample image with a highlighted area comprising a defect.

7. The quality assurance system as in claim 1, wherein said detector array is a linear detector array.

8. A method of inspecting a structure of a device, comprising:

generating a sample image of a device having a structure to be inspected, wherein said generating comprises;

moving said device, a detector array or both, relative to one another, wherein the detector array is configured to generate a line of data representing light reflected from the device, and

assembling lines of data from said detector array to generate a sample image;

identifying a plurality of features of said sample image;

comparing said plurality of features to a corresponding plurality of features of a reference image; and

locating features in said sample image that deviate from corresponding features of the reference image.

9. The inspecting method as in claim 8, wherein said moving comprises:

positioning the device on a moveable stage, and

moving the stage relative to the detector array.

10. The inspecting method as in claim 8, wherein said method further comprises:

generating a reference image by combining at least three images of devices meeting a quality control threshold.

11. The inspecting method as in claim 8, wherein said generating step, further comprises:

pre-processing said sample image prior to said comparing step.

12. The inspecting method as in claim 8, further comprising:

classifying each deviating feature by a type of defect according to a predetermined classification system.

13. The inspecting method as in claim 12, wherein said predetermined classification system includes defect classifications selected from the group consisting of feature area, feature aspect ratio, RGB color, feature position, boundary region length, roundness of feature, major axis length and minor axis length.

14. The method as in claim 8, wherein the structure of the device being inspected is selected from the group consisting of a printed circuit board substrate or a ball grid array.

15. The inspecting method as in claim 8, further comprising:

inputting a type of structure being inspected; and

selecting said reference image based on said structure being inspected.

16. The inspecting method as in claim 15, wherein said plurality of features of said sample image are identified based on defect detection parameters specific to said type of structure being inspected.

17. The inspecting method as in claim 8, wherein said identifying comprises calculating image parameters for said sample image using defect detection parameters.

18. The inspecting method as in claim 17, further comprising:

updating said detection parameters based on analysis of said sample image.

19. The inspecting method as in claim 8, wherein said detector array is a linear detector array.

20. A method of inspecting a device having a plurality of structures, comprising:

generating a sample image of a device having a plurality of structures to be inspected, wherein said generating comprises;

moving said device, a detector array or both, relative to one another, wherein the detector array is configured to generate a line of data representing light reflected from the device, and

assembling lines of data from said detector array to generate a sample image;

identifying a plurality of features of said sample image;

comparing said plurality of features to a corresponding plurality of features of a reference image;

locating features in said sample image that deviate from corresponding features of the reference image; and

determining whether or not said device meets a predefined quality control threshold, wherein said identifying comprises calculating image parameters for said sample image using defect detection parameters specific to said type of structure being inspected.