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WIRE DISCHARGE MACHINING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFERS USING THE SAME

  • US 20150053650A1
  • Filed: 10/19/2012
  • Published: 02/26/2015
  • Est. Priority Date: 04/12/2012
  • Status: Abandoned Application
First Claim
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1. A wire discharge machining apparatus comprising:

  • a pair of guide rollers disposed in parallel at intervals;

    a wire that is wound between the pair of guide rollers a plurality of times while being spaced apart from each other at a fixed pitch to form a parallel wire section between the pair of guide rollers and travels according to the rotation of the guide rollers;

    a pair of damping guide rollers that are provided between the pair of guide rollers, follow and come into contact with the parallel wire section, and form a plurality of damped cutting wire sections;

    a plurality of power feed terminals that feed electric power to each of the cutting wire sections; and

    a unit that moves a work piece to the cutting wire sections relatively in a parallel direction of wires forming the cutting wire sections and a direction perpendicular to the parallel direction of the wires forming the cutting wire sections in such a manner as to bring the wires of the cutting wire sections closer to either one of a pair of cut surfaces formed by being cut by the wires of the cutting wire sections than the other, whereinthe wire discharge machining apparatus scans either one of the cut surfaces in a discharge-machined state to thereby simultaneously finish the cut surfaces.

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