WIRE DISCHARGE MACHINING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFERS USING THE SAME
First Claim
1. A wire discharge machining apparatus comprising:
- a pair of guide rollers disposed in parallel at intervals;
a wire that is wound between the pair of guide rollers a plurality of times while being spaced apart from each other at a fixed pitch to form a parallel wire section between the pair of guide rollers and travels according to the rotation of the guide rollers;
a pair of damping guide rollers that are provided between the pair of guide rollers, follow and come into contact with the parallel wire section, and form a plurality of damped cutting wire sections;
a plurality of power feed terminals that feed electric power to each of the cutting wire sections; and
a unit that moves a work piece to the cutting wire sections relatively in a parallel direction of wires forming the cutting wire sections and a direction perpendicular to the parallel direction of the wires forming the cutting wire sections in such a manner as to bring the wires of the cutting wire sections closer to either one of a pair of cut surfaces formed by being cut by the wires of the cutting wire sections than the other, whereinthe wire discharge machining apparatus scans either one of the cut surfaces in a discharge-machined state to thereby simultaneously finish the cut surfaces.
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Accused Products
Abstract
A wire discharge machining apparatus including a plurality of main guide rollers disposed in parallel at intervals, one wire that is wound between the guide rollers while being spaced apart from one another at a fixed pitch to form cutting wire sections between a pair of guide rollers and travels according to the rotation of the main guide rollers, and power feed terminal units that feed electric power to wires of the cutting wire sections. The wire discharge machining apparatus performs cutting of a work piece with the cutting wire sections, suspends cut-out of semiconductor wafers from the work piece in a state in which a part of the semiconductor wafers is connected to the work piece, brings the wires of the cutting wire sections close to one cut surfaces, and scans the cut surfaces in a discharge-machined state.
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Citations
16 Claims
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1. A wire discharge machining apparatus comprising:
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a pair of guide rollers disposed in parallel at intervals; a wire that is wound between the pair of guide rollers a plurality of times while being spaced apart from each other at a fixed pitch to form a parallel wire section between the pair of guide rollers and travels according to the rotation of the guide rollers; a pair of damping guide rollers that are provided between the pair of guide rollers, follow and come into contact with the parallel wire section, and form a plurality of damped cutting wire sections; a plurality of power feed terminals that feed electric power to each of the cutting wire sections; and a unit that moves a work piece to the cutting wire sections relatively in a parallel direction of wires forming the cutting wire sections and a direction perpendicular to the parallel direction of the wires forming the cutting wire sections in such a manner as to bring the wires of the cutting wire sections closer to either one of a pair of cut surfaces formed by being cut by the wires of the cutting wire sections than the other, wherein the wire discharge machining apparatus scans either one of the cut surfaces in a discharge-machined state to thereby simultaneously finish the cut surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 15, 16)
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9. A manufacturing method for semiconductor wafers using a wire discharge machining apparatus including:
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a plurality of guide rollers disposed in parallel at intervals; a wire that is wound between the plurality of guide rollers while being spaced apart from each other at a fixed pitch to form cutting wire sections between a pair of the guide rollers within the plurality of guide rollers and travels according to the rotation of the guide rollers; power feed terminals that feed electric power to wires of the cutting wire sections; and a unit that moves a work piece to the cutting wire sections in a parallel direction of wires forming each of the cutting wire sections and a direction perpendicular to the parallel direction of the wires forming the cutting wire sections in such a manner as to bring the wires of the cutting wire sections closer to either one of a pair of cut surfaces formed by being cut by the wires of the cutting wire sections than to the other, the manufacturing method comprising; a first step of cutting a work piece with the cutting wire sections and cutting out a plurality of wafers from the work piece; and a second step of bringing the wires of the cutting wire sections closer to either one of a pair of cut surfaces formed by being cut at the first step using the wires of the cutting wire sections than to the other and scanning the cut surfaces in a discharge-machined state. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification