HEATING ELEMENTS FOR AIRCRAFT HEATED FLOOR PANELS
First Claim
Patent Images
1. A method of forming a heating element, the method comprising:
- depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit; and
heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×
10−
6 ohm·
meter.
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Abstract
A method of forming a heating element includes depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit, and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×10−6 ohm·meter. An aircraft heated floor panel includes at least one floor panel of an aircraft includes a conductive circuit positioned within the floor panel having a conductive ink of silver particles in an epoxy resin on a dielectric film.
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Citations
15 Claims
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1. A method of forming a heating element, the method comprising:
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depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit; and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×
10−
6 ohm·
meter. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An aircraft heated floor panel comprising:
at least one floor panel of an aircraft includes a heating element with a conductive circuit positioned within the floor panel, wherein the conductive circuit includes a conductive ink of silver particles in an epoxy resin on a dielectric film. - View Dependent Claims (10, 11, 12, 13, 14, 15)
Specification