ELECTRONIC COMPONENT WITH COIL, METHOD FOR MANUFACTURING THE SAME AND POWER SUPPLY MODULE

• US 20150055311A1
• Filed: 08/21/2013
• Published: 02/26/2015
• Est. Priority Date: 08/21/2013
• Status: Active Grant

• Current Assignee: Sumida Corporation
• Original Assignee: Sumida Corporation
• Inventors: KAWARAI, Mitsugu, MALCOLM, Douglas James
• Granted Patent: US 9,167,682 B2
• Time in Patent Office: Days
• US Class Current: 361/782
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

An electronic component includes a circuit board that includes a ground terminal connected to a ground potential, a coil component that is assembled on the circuit board, the coil component includes a T-shaped core and an air-core coil, a ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, and a mixture of a metal composite magnetic material and a resin that is formed on the circuit board and that covers the coil component and the ground connection electrode as a package. A part of the ground connection electrode is exposed outside the mixture.

Claims

1. An electronic component comprising:

a circuit board that includes a ground terminal connected to a ground potential;

a coil component that is assembled on the circuit board, the coil component includes a T-shaped core and an air-core coil;

a ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal; and

a mixture of a metal composite magnetic material and a resin that is formed on the circuit board and that covers the coil component and the ground connection electrode as a package, wherein

a part of the ground connection electrode is exposed outside the mixture.

2. The electronic component according to claim 1, wherein

the ground connection electrode is in a bar shape, and a tip of the ground connection electrode is exposed outside the mixture.

3. The electronic component according to claim 2, further comprising:

another ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, wherein

the another ground connection electrode is in the bar shape, and a tip of the another ground connection electrode is exposed outside the mixture.

4. The electronic component according to claim 1, wherein

the ground connection electrode is in a rectangular arch shape, and at least one of a top and a side of the ground connection electrode is exposed outside the mixture.

5. The electronic component according to claim 4, further comprising:

another ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, wherein

the another ground connection electrode is in the rectangular arch shape, and at least one of a top and a side of the another ground connection electrode is exposed outside the mixture.

6. The electronic component according to claim 1, wherein

the circuit board includes a plurality of board layers, and the ground terminal is provided on one of the plurality of board layers that faces another of the plurality of board layers.

7. A method for manufacturing an electronic component comprising:

placing a T-shaped core, an air-core coil and a ground connection electrode, which are assembled on a circuit board having a ground terminal connected to a ground potential, in a metal mold, the ground connection electrode being located next to the air-core coil and being connected to the ground terminal;

injecting a mixture of a metal composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture;

heating the mixture at a first temperature;

hardening the mixture; and

polishing an outside of the hardened mixture, wherein

a part of the ground connection electrode is exposed outside the mixture.

8. The method for manufacturing an electronic component according to claim 7, wherein

the first temperature is in a range of 60 to 100°

C., and

the heating process is performed for 5 to 120 minutes.

9. The method for manufacturing an electronic component according to claim 7, wherein

the hardening process is performed by heating the mixture at a second temperature in a range of 120 to 200°

C. for 10 to 90 minutes.

10. The method for manufacturing an electronic component according to claim 7 further comprising:

applying a pressure of 0.1 to 20.0 kg/cm² to the mixture to adjust an outer shape of the mixture.

11. The method for manufacturing an electronic component according to claim 7, wherein

the injecting process is performed by a dispenser that includes:

a discharge opening that discharges the mixture;

a material tank that stores a material for the mixture;

a flow passage through which the material flows;

a valve that is provided in the flow passage and controls a flow of the material;

a valve driving unit that opens and closes the valve; and

a mixer that is provided at a trailing end of the flow passage and that mixes the material with another material to form the mixture, and that supplies the mixture toward the discharge opening.

12. The method for manufacturing an electronic component according to claim 7, wherein

the injecting process is performed by a dispenser that includes:

a discharge opening that discharges the mixture;

a material tank that stores the mixture;

a flow passage in which the mixture flows;

a valve that is provided in the flow passage and controls a flow of the mixture;

a valve driving unit that opens and closes the valve; and

a mixer that is provided at a trailing end of the flow passage and that mixes the mixture, and that supplies the mixture toward the discharge opening.

13. The method for manufacturing an electronic component according to claim 7 further comprising:

removing excessive mixture from a surface of the mixture by a remover before the heating is performed.

14. The method for manufacturing an electronic component according to claim 13, wherein

the remover slides along the top surface of the mixture at an angle of 0 to 20 degrees with respect to a surface of the metal mold and applies a pressure of 0.1 to 20.0 kg/cm² to the mixture.

15. A power supply module, comprising:

a circuit board that includes a ground terminal connected to a ground potential;

a coil component that is assembled on the circuit board, the coil component includes a T-shaped core and an air-core coil;

passive components including a capacitor and a resistor that are assembled on the circuit board;

an integrated circuit that is assembled on the circuit board;

a ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal; and

a mixture of a metal composite magnetic material and a resin that is formed on the circuit board and that covers the coil component, the passive components, the integrated circuit and the ground connection electrode as a package, wherein

a part of the ground connection electrode is exposed outside the mixture.

16. The power supply module according to claim 15, wherein

the ground connection electrode is in a bar shape, and a tip of the ground connection electrode is exposed outside the mixture.

17. The power supply module according to claim 16, further comprising:

another ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, wherein

the another ground connection electrode is in the bar shape, and a tip of the another ground connection electrode is exposed outside the mixture.

18. The power supply module according to claim 15, wherein

the ground connection electrode is in a rectangular arch shape, and at least one of a top and a side of the ground connection electrode is exposed outside the mixture.

19. The power supply module according to claim 18, further comprising:

another ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, wherein

the another ground connection electrode is in the rectangular arch shape, and at least one of a top and a side of the another ground connection electrode is exposed outside the mixture.

20. The electronic component according to claim 15, wherein

the circuit board includes a plurality of board layers, and the ground terminal is provided on one of the plurality of board layers that faces another of the plurality of board layers.