NOVEL 3D STRUCTURE FOR ADVANCED SRAM DESIGN TO AVOID HALF-SELECTED ISSUE

• US 20150055402A1
• Filed: 08/22/2013
• Published: 02/26/2015
• Est. Priority Date: 08/22/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: SHIEH, HAU-TAI, CHEN, CHIEN-YUAN, HUANG, CHIEN-YU
• Granted Patent: US 9,001,546 B2
• Time in Patent Office: Days
• US Class Current: 365/156
• CPC Class Codes: G11C 11/418 Address circuits
• CPC Class Codes: G11C 2213/71 Three dimensional array
• CPC Class Codes: G11C 2213/78 Array wherein the memory cells of a group share an access device, all the memory cells of the group having a common electrode and the access device being not part of a word line or a bit line driver
• CPC Class Codes: G11C 5/06 Arrangements for interconnecting storage elements electrically, e.g. by wiring
• CPC Class Codes: G11C 7/12 Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
• CPC Class Codes: G11C 8/08 Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
• CPC Class Codes: G11C 8/10 Decoders

Abstract

Disclosed is a novel static random access memory (SRAM) device. The SRAM device comprises a plurality of memory array layers vertically disposed one above another, a layer decoder circuit disposed on each memory array layer, a word line driver circuit disposed on each memory array layer, and a plurality of complementary bit line pairs wherein each complementary bit line pair extends vertically to couple a memory cell in each memory array layer. Each memory array layer comprises a plurality of memory cells and a word line disposed thereon. Each word line is connected to the plurality of memory cells disposed on its memory array layer. The number of memory cells in a layer corresponds to a predetermined memory page size. Each layer decoder circuit is configured to decode a portion of an SRAM address to select its memory array layer if the SRAM address corresponds to memory cells on its memory array layer. Each word line driver circuit is configured to drive the word line disposed on its memory array layer.

Claims

1. A static random access memory (SRAM) device comprising:

a plurality of memory array layers vertically disposed one above another, each memory array layer comprising a plurality of memory cells and a word line disposed thereon, each word line being connected to the plurality of memory cells disposed on its memory array layer, wherein the number of memory cells in a layer corresponds to a predetermined memory page size;

a layer decoder circuit disposed on each memory array layer, each layer decoder circuit being configured to decode a portion of an SRAM address to select its memory array layer if the SRAM address corresponds to memory cells on its memory array layer;

a word line driver circuit disposed on each memory array layer, each word line driver circuit being configured to drive the word line disposed on its memory array layer; and

a plurality of complementary bit line pairs, each complementary bit line pair extending vertically to couple a memory cell in each memory array layer.

2. The SRAM device of claim 1, wherein the layer decoder circuitry on each memory array layer is operative to send a data retention signal to each memory cell in its layer if the SRAM address does not correspond to memory cells on its memory array layer.

3. The SRAM device of claim 2, wherein each memory cell comprises circuitry for putting the memory cell in a data retention mode when it receives a data retention signal.

4. The SRAM device of claim 3, wherein the circuitry for putting the memory cell in a data retention mode comprises a diode clamped MOSFET transistor coupled between the power source and the cross-coupled PMOS transistors in the memory cell.

5. The SRAM device of claim 1, further comprising input/output (I/O) circuitry disposed in a semiconductor layer above or below the memory array layers.

6. The SRAM device of claim 5, wherein the I/O circuitry is disposed in multiple semiconductor layers above or below the memory array layers.

7. The SRAM device of claim 1, wherein the memory array layers have a number of cells in a first direction and a number of cells in a second direction and the number of cells in the first direction times the number of cells in the second direction corresponds to the number of I/O data lines in the SRAM device.

8. The SRAM device of claim 1, wherein the number of memory array layers equals the number of memory pages for the SRAM device.

9. The SRAM device of claim 1, wherein memory cell selection by the layer decoder allows the SRAM device to perform a page read operation or a page write operation.

10. A static random access memory (SRAM) device comprising:

a plurality of memory array layers vertically disposed one above another, each memory array layer comprising a plurality of memory cells and a word line disposed thereon, wherein each word line is connected to the plurality of the memory cells disposed on its memory array layer, wherein the number of memory cells in a layer corresponds to a predetermined memory page size;

a layer decoder circuit on each memory array layer, each layer decoder circuit being configured to decode a portion of an SRAM address to select its memory array layer if the SRAM address corresponds to memory cells on its memory array layer;

a word line driver configured to drive the word line disposed on the selected memory array layer; and

a plurality of complementary bit line pairs, each complementary bit line pair extending vertically to couple to a memory cell in each memory array layer;

wherein the SRAM device is configured to activate only the word line connected to those memory cells selected by the SRAM address so that a read operation or a write operation does not result in a non-selected memory cell consuming unnecessary power.

11. The SRAM device of claim 10, wherein the word line driver comprises a word line driver circuit disposed on each memory array layer, each word line driver circuit being configured to drive one of the plurality of word lines disposed on its memory array layer.

12. The SRAM device of claim 11, wherein each word line driver circuit is configured to drive the word line disposed on its memory array layer when the layer decoder circuit disposed on its memory array layer determines that the SRAM address corresponds to memory cells on its memory array layer.

13. The SRAM device of claim 11, wherein the layer decoder circuitry on each memory array layer is operative to send a data retention signal to each memory cell in its layer if the SRAM address does not correspond to memory cells on its memory array layer.

14. The SRAM device of claim 13, wherein each memory cell comprises circuitry for putting the memory cell in a data retention mode when it receives a data retention signal.

15. A method in a static random access memory (SRAM) device comprising:

providing a plurality of memory array layers vertically disposed one above another, each memory array layer comprising a plurality of memory cells disposed thereon, each memory array layer further comprising a layer decoder configured to decode a portion of an SRAM address to determine the memory array layer on which the memory cells addressed by the SRAM address are disposed;

providing a word line on each memory array layer, wherein each word line is connected to each memory cell in the memory array layer on which the word line is disposed; and

providing a plurality of complementary bit line pairs, each complementary bit line pair extending vertically to couple to a memory cell in each memory array layer;

wherein each word line is connected to a number of memory cells equal to the number of input/output data lines in the device.

16. The method of claim 15, further comprising:

providing a word line driver configured to operate cooperatively with the layer decoder to drive a word line connected to the memory cells addressed by the SRAM address.

17. The method of claim 16, wherein the word line driver comprises a word line driver circuit disposed on each memory array layer, each word line driver circuit being configured to the word line disposed on its memory array layer.

18. The method of claim 15, further comprising input/output (I/O) circuitry disposed in a semiconductor layer above or below the memory array layers, wherein the I/O circuitry is disposed in multiple semiconductor layers above or below the memory array layers.

19. The method of claim 15, wherein the layer decoder circuitry on each memory array layer is configured to send a data retention signal to each memory cell in its layer if the SRAM address does not correspond to memory cells on its memory array layer.

20. The method of claim 15, wherein the memory array layers have a number of cells in a first direction and a number of cells in a second direction and the number of cells in the first direction times the number of cells in the second direction corresponds to the number if I/O data lines in the SRAM device.