×

THERMAL MODULE

  • US 20150060020A1
  • Filed: 09/02/2013
  • Published: 03/05/2015
  • Est. Priority Date: 09/02/2013
  • Status: Active Grant
First Claim
Patent Images

1. A thermal module comprising a housing having multiple independent compartments not in communication with each other, each compartment communicating with an open end of at least one heat pipe, the open end communicating with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×