COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

• US 20150060115A1
• Filed: 11/13/2013
• Published: 03/05/2015
• Est. Priority Date: 08/28/2013
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Sa Yong, Moon, Jin Seok, Lee, Keun Yong
• Application Number:
  US14/079,236
• Publication Number:
  US 20150060115A1
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: B32B 15/14 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2260/023 Two or more layers
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2262/0269 Aromatic polyamide fibres
• CPC Class Codes: B32B 2262/101 Glass fibres
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2307/308 Heat stability dimensional stability B32B2307/734
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0358 Resin coated copper [RCC]
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2203/0271 Mechanical force other than pressure, e.g. shearing or pulling
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/249921 Web or sheet containing structurally defined element or component

Abstract

Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first resin-coated copper foil (RCC) and a resin layer of a second resin-coated copper foil and having a structure in which the resin layers are symmetric or asymmetric based on the composite, and a manufacturing method thereof. A thickness of the copper clad laminate may be manufactured at the desired thickness or the thickness may be uniformly maintained, such that stabilization of thickness quality may be implemented, the adhesion between the copper foil and the resin may be improved, and warpage may be adjusted when laminating substrates having different upper and lower thermal expansion coefficients.

Claims

1. A copper clad laminate for a printed circuit board, the copper clad laminate comprising:

a composite having a glass fibers formed on both sides of a prepreg disposed between a resin layer of a first resin-coated copper foil (a first RCC) and a resin layer of a second resin-coated copper foil (a second RCC),

wherein the resin layers have a symmetric or asymmetric structure based on the composite.

2. The copper clad laminate as set forth in claim 1, wherein the resin layers of the first RCC and the second RCC have the same thickness or different thickness, the same composition or different composition, or the same kind and content or different kind and content of inorganic filler included in the composition.

3. The copper clad laminate as set forth in claim 1, wherein the composite is formed by further including at least one other prepreg between the prepreg and the glass fiber and laminating the prepreg, the at least one other prepreg, and the glass fiber.

4. The copper clad laminate as set forth in claim 1, further comprising an insulator having the glass fiber formed on one side of the prepreg between the first RCC and the composite, between the second RCC and the composite, or both.

5. The copper clad laminate as set forth in claim 4, wherein the glass fiber formed on one side of the insulator contacts the resin layers of the first RCC and the second RCC and includes at least one insulator.

6. The copper clad laminate as set forth in claim 1, wherein the glass fibers formed on both sides of the composite are the same kind or different kinds.

7. The copper clad laminate as set forth in claim 1, wherein the glass fiber is at least one selected from a group consisting of E-glass, T-glass, S-glass, U-glass, quartz fiber textile, and aramid fiber textile.

15. A printed circuit board manufactured by forming a circuit pattern on a copper foil of the copper clad laminate as set forth in claim 1.

8. A manufacturing method of a copper clad laminate for a printed circuit board, the manufacturing method comprising:

providing a first RCC and a second RCC;

forming a copper clad laminate by laminating and pressurizing a composite having glass fibers formed on both sides of a prepreg between a resin layer of the first RCC and a resin layer of the second RCC; and

hardening the copper clad laminate.

9. The manufacturing method as set forth in claim 8, wherein the resin layers of the first RCC and the second RCC have the same thickness or different thickness, the same composition or different composition, or the same kind and content or different kind and content of inorganic filler included in the composition.

10. The manufacturing method as set forth in claim 8, wherein the forming of the copper clad laminating includes laminating an insulator having the glass fiber formed on one side of the prepreg between the first RCC and the composite, between the second RCC and the composite, or both.

11. The manufacturing method as set forth in claim 10, wherein the glass fiber formed on one side of the insulator is laminated so as to be in contact with the resin layers of the first RCC and the second RCC, and in the laminating of the insulator, at least one insulator is laminated.

12. The manufacturing method as set forth in claim 8, wherein the glass fibers formed on both sides of the composite are the same kind or different kinds.

13. The manufacturing method as set forth in claim 8, wherein the glass fiber is at least one selected from a group consisting of E-glass, T-glass, S-glass, U-glass, quartz fiber textile, and aramid fiber textile.

14. The manufacturing method as set forth in claim 8, wherein the pressuring is performed by roll pressurization.