LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF, AND BACKLIGHT UNIT

• US 20150060905A1
• Filed: 08/28/2014
• Published: 03/05/2015
• Est. Priority Date: 08/28/2013
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: NAM, Ki Bum, HAN, Yu Dae
• Granted Patent: US 9,570,424 B2
• Time in Patent Office: Days
• US Class Current: 257/89
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light source module includes a circuit board, light emitting diode chips mounted on the circuit board by flip-chip bonding or a surface mounting technology (SMT), and a diffusor covering the circuit board and the light emitting diode chips.

Claims

1. A light source module, comprising:

a circuit board;

light emitting diode chips mounted on the circuit board by flip-chip bonding or a surface mounting technology (SMT); and

a diffusor covering the circuit board and the light emitting diode chips.

2. The light source module of claim 1, further comprising a wavelength converting layer covering the light emitting diode chips.

3. The light source module of claim 1, further comprising a reflector disposed between the light emitting diode chips.

4. The light source module of claim 2, further comprising a reflector disposed between the light emitting diode chips, wherein the diffusor is disposed on an upper surface of the reflector and an upper surface of the wavelength converting layer.

5. The light source module of claim 2, further comprising a transflective layer disposed on the wavelength converting layer, the transflective layer configured to transmit a portion of received light and reflect a remaining portion of the received light.

6. The light source module of claim 1, further comprising an adhesive member disposed between the light emitting diode chips and contacting the circuit board.

7. The light source module of claim 6, wherein the adhesive member comprises a reflecting material and is a film-type adhesive member.

8. The light source module of claim 6, wherein the adhesive member comprises a reflecting layer and an adhesive layer.

9. The light source module of claim 1, further comprising a protrusions disposed on an upper surface of the diffusor.

10. The light source module of claim 9, wherein the protrusions each have a semi-cylindrical or hemispherical shape and are spaced apart from one another on the upper surface of the diffusor.

11. The light source module of claim 9, wherein the protrusions form a concavo-convex structure.

12. The light source module of claim 1, further comprising bumps disposed between the light emitting diode chips and the circuit board, the bumps electrically connecting electrode pads of the light emitting diode chips and board pads of the circuit board.

13. The light source module of claim 12, further comprising a heat radiating bump disposed between the bumps.

14. A light source module, comprising:

a diffusor;

light emitting diode chips disposed on a lower surface of the diffusor;

a first resin covering the light emitting diode chips and a the lower surface of the diffusor;

bumps connected to electrodes of the light emitting diode chips and exposed from the first resin;

a second resin covering the first resin; and

conductive patterns disposed on the bumps and covered by the second resin.

15. The light source module of claim 14, further comprising a heat sink,

wherein the second resin is disposed between the heat sink and the light emitting diode chips.

16. The light source module of claim 14, further comprising a reflecting layer disposed on an upper surface of the diffusor.

17. The light source module of claim 16, further comprising a wavelength converting layer disposed on the second resin.

18. The light source module of claim 14, wherein the conductive pattern comprises a transparent conductive material.