COMPACT SENSOR MODULE

• US 20150061043A1
• Filed: 09/05/2014
• Published: 03/05/2015
• Est. Priority Date: 02/27/2012
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Bolognia, David Frank
• Granted Patent: US 9,466,594 B2
• Time in Patent Office: Days
• US Class Current: 257/414
• CPC Class Codes: G01T 1/16 Measuring radiation intensity G01T1/29 takes precedence ; self-powered detectors G01T3/006; using an ionisation chamber filled with a liquid or solid, e.g. frozen liquid, dielectric G01T3/008
• CPC Class Codes: G01T 1/24 with semiconductor detectors
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 31/115 Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation

Abstract

A compact sensor module and methods for forming the same are disclosed herein. In some embodiments, a sensor die is mounted on a sensor substrate. A processor die can be mounted on a flexible processor substrate. In some arrangements, a thermally insulating stiffener can be disposed between the sensor substrate and the flexible processor substrate. At least one end portion of the flexible processor substrate can be bent around an edge of the stiffener to electrically couple to the sensor substrate

Claims

1. (canceled)

2. A sensor module comprising:

a substrate;

a sensor die in electrical communication with the substrate;

a processor die in electrical communication with the substrate; and

a stiffener having a first side and a second side opposite the first side,

wherein the first and second sides of the stiffener include major surfaces of the stiffener, the stiffener disposed between the sensor die and the processor die such that the first side faces the sensor die and a first normal line passes perpendicularly through the major surface of the first side and intercepts the sensor die, and such that the second side faces the processor die and a second normal line passes perpendicularly through the major surface of the second side and intercepts the processor die,

wherein the substrate is bent around an edge of the stiffener to electrically couple the sensor die and the processor die.

3. The sensor module of claim 2, further comprising a sensor substrate to which the sensor die is mounted, the sensor substrate positioned between the sensor die and the substrate.

4. The sensor module of claim 3, wherein the processor die is mounted to a mounting portion of the substrate, and wherein an end portion of the substrate that extends from the mounting portion is bent around the edge of the stiffener to electrically connect to the sensor substrate.

5. The sensor module of claim 4, wherein the mounting portion of the substrate is coupled to the second side of the stiffener.

6. The sensor module of claim 5, wherein the mounting portion of the processor substrate has a first surface facing the stiffener and a second surface opposite the first surface, and wherein the processor die is mounted on the second surface of the mounting portion.

7. The sensor module of claim 6, further comprising a plurality of passive electrical components electrically coupled to the first surface of the mounting portion and positioned within at least one recess formed in the second side of the stiffener.

8. The sensor module of claim 3, wherein the stiffener is disposed between the substrate and the sensor substrate.

9. The sensor module of claim 3, wherein first and second opposite end portions of the substrate bend around edges of the stiffener to electrically connect to the sensor substrate.

10. The sensor module of claim 3, wherein a first end portion of the substrate is bent through a first aperture formed in the stiffener to electrically communicate with the sensor substrate.

11. The sensor module of claim 10, wherein the first end portion is folded over at least part of the first side of the stiffener.

12. The sensor module of claim 2, further comprising a radiation shield coupled with the first side of the stiffener.

13. The sensor module of claim 12, wherein the radiation shield is housed within a recess formed in the first side of the stiffener.

14. The sensor module of claim 2, wherein the sensor die comprises an image sensor die.

15. The sensor module of claim 14, wherein the sensor die comprises a photodiode array.

16. An imaging device comprising an array of multiple sensor modules, each sensor module in the array comprising the sensor module of claim 2.

17. The imaging device of claim 16, wherein the imaging device is a CT device.

18. A sensor module comprising:

a substrate;

a sensor die in electrical communication with the substrate;

a processor die in electrical communication with the substrate; and

a stiffener having an first side and a second side opposite the first side, wherein the substrate is bent around an edge of the stiffener to electrically couple the sensor die and the processor die, wherein a first segment of the substrate is disposed along the first side of the stiffener and a second segment of the substrate is disposed along the second side of the stiffener.

19. The sensor module of claim 18, further comprising a sensor substrate to which the sensor die is mounted, wherein the processor die is mounted to a mounting portion of the substrate, and wherein an end portion of the substrate that extends from the mounting portion is bent around the edge of the stiffener to electrically connect to the sensor substrate, the first segment comprising the end portion and the second segment comprising the mounting portion.

20. The sensor module of claim 19, wherein the stiffener is disposed between the sensor substrate and the mounting portion of the substrate.

21. The sensor module of claim 20, wherein the first and second sides of the stiffener include major surfaces of the stiffener, the stiffener disposed between the sensor substrate and the mounting portion of the substrate such that the first side faces the sensor substrate and a first normal line passes perpendicularly through the major surface of the first side and intercepts the sensor substrate, and such that the second side faces the mounting portion of the substrate and a second normal line passes perpendicularly through the major surface of the second side and intercepts the mounting portion of the substrate.