Packaged MEMS Device

• US 20150061048A1
• Filed: 08/27/2013
• Published: 03/05/2015
• Est. Priority Date: 08/27/2013
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Escher-Poeppel, Irmgard, Fuergut, Edward, Dehe, Alfons
• Granted Patent: US 9,584,889 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: H04R 1/021 incorporating only one transducer
• CPC Class Codes: H04R 1/086 Protective screens, e.g. all weather or wind screens
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 2201/02 Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
• CPC Class Codes: H04R 2231/003 Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms
• CPC Class Codes: H04R 31/006 Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003

Abstract

A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped MEMS die embedded into the embedding material. The MEMS die may comprise a diaphragm for sound transduction. The sound transducer component may further comprise a sound port within the embedding material in fluidic or acoustic contact with the diaphragm. Further embodiments relate to a method for packaging a MEMS device or to a method for manufacturing a sound transducer component.

Claims

1. A packaged MEMS device comprising:

an embedding arrangement;

a MEMS device disposed in the embedding arrangement;

a sound port disposed in the embedding arrangement, the sound port acoustically coupled to the MEMS device; and

a grille disposed in the sound port.

2. The packaged MEMS device according to claim 1, wherein the grille is electrically conductive.

3. The packaged MEMS device according to claim 2, wherein the MEMS device further comprises a diaphragm and wherein the grille is configured to function as a backplate of a capacitive transducer in combination with the diaphragm.

4. The packaged MEMS device according to claim 1, wherein the embedding arrangement comprises a mold compound.

5. The packaged MEMS device according to claim 1, wherein the embedding arrangement comprises a main embedding part and a cover layer at a first surface of the main embedding part, the MEMS device being embedded in the main embedding part.

6. The packaged MEMS device according to claim 5, wherein the sound port extends through the cover layer and wherein the grille is within a portion of the sound port that extends through the cover layer.

7. The packaged MEMS device according to claim 5, wherein the cover layer comprises a redistribution layer.

8. The packaged MEMS device according to claim 7, wherein the grille is part of the redistribution layer.

9. The packaged MEMS device according to claim 7, wherein the grille is electrically conductive and the redistribution layer is in electrical contact with the grille.

10. The packaged MEMS device according to claim 7, wherein the redistribution layer is configured to provide at least one electrical contact for the MEMS device.

11. The packaged MEMS device according to claim 7, wherein the redistribution layer is configured to provide an electromagnetic interference shielding for at least one of the MEMS device, electrical connections for the MEMS device, and an underlying redistribution layer.

12. The packaged MEMS device according to claim 5, wherein the MEMS device is recessed with respect to a first main surface and an opposite second main surface of the main embedding part.

13. The packaged MEMS device according to claim 1, further comprising:

a further device embedded into the embedding arrangement; and

an electrical connection between the MEMS device and the further device.

14. The packaged MEMS device according to claim 1, further comprising a cavity formed within the embedding arrangement adjacent to the MEMS device at an opposite side of the MEMS device than the sound port.

15. The packaged MEMS device according to claim 14, wherein a cross section of the cavity is substantially equal to a surface of the MEMS device.

16. The packaged MEMS device according to claim 1, wherein the MEMS device comprises substrate-stripped MEMS die.

17. The packaged MEMS device according to claim 1, wherein the sound port includes an opening.

18. The packaged MEMS device according to claim 1, wherein the sound port is adjacent the MEMS device.

19. A packaged MEMS device comprising:

an embedding arrangement;

a MEMS device disposed in the embedding arrangement;

an opening disposed in the embedding arrangement, the opening adjacent to the MEMS device; and

a grille within the opening.

20. A packaged MEMS device comprising:

an embedding arrangement;

a MEMS device disposed in the embedding arrangement;

a sound port embedded in the embedding arrangement, the sound port acoustically coupled to the MEMS device; and

a grille across the sound port.

21. The packaged MEMS device according to claim 20, wherein the sound port includes an opening, the grille being across the opening.

22. The packaged MEMS device according to claim 20, wherein the sound port is adjacent to the MEMS device.

23. A sound transducer component comprising:

an embedding material;

a substrate-stripped MEMS die embedded into the embedding material, the MEMS die comprising a diaphragm for sound transduction; and

a sound port within the embedding material in fluidic contact with the diaphragm.

24. A method for packaging a MEMS device, the method comprising:

embedding a precursor MEMS die in an embedding arrangement to obtain an embedded precursor MEMS die;

creating a grille at a surface of the embedded precursor MEMS die; and

removing an auxiliary portion of the embedded precursor MEMS die adjacent to the grille to create a sound port within the embedding arrangement.

25. The method according to claim 24, wherein the grille is electrically conductive.

26. The method according to claim 24, wherein removing the auxiliary portion comprises introducing at least one of an etching agent, a solvent, and an oxidant for the auxiliary portion through the grille.

27. The method according to claim 24, further comprising:

removing, at least partly, a sacrificial layer of the precursor MEMS die after embedding the precursor MEMS die in the embedding arrangement.

28. The method according to claim 24, wherein creating the grille comprises:

depositing a mask material at the surface of the embedded precursor MEMS die;

structuring the mask material to provide cavities within the mask material;

depositing a grille material within the cavities; and

removing remaining mask material between the deposited grille material to provide the grille.

29. The method according to claim 24, further comprising:

providing a cover layer at a surface of one of the precursor MEMS die and of the embedded precursor MEMS die.

30. The method according to claim 29, wherein the cover layer comprises a redistribution layer.

31. The method according to claim 24, further comprising:

creating at least one via within the embedding arrangement to provide at least one electrical contact for the MEMS die.

32. A method for manufacturing a sound transducer component, the method comprising:

creating a plurality of spacers at a surface of a wafer comprising a plurality of precursor MEMS dies, each spacer covering at least a portion of a diaphragm of a corresponding MEMS die;

singulating the wafer to obtain a plurality of singulated precursor MEMS dies;

embedding a selected number of the plurality of singulated precursor MEMS dies together with the spacers in an embedding arrangement to form a reconstitution wafer;

removing the plurality of spacers to obtain a plurality of sound ports within the embedding arrangement; and

singulating the reconstitution wafer thereby forming the sound transducer component.