ATTENUATION SYSTEMS WITH COOLING FUNCTIONS AND RELATED COMPONENTS AND METHODS

• US 20150062816A1
• Filed: 08/27/2014
• Published: 03/05/2015
• Est. Priority Date: 08/29/2013
• Status: Active Grant

• Current Assignee: Corning Optical Communications LLC (Corning Incorporated)
• Original Assignee: Corning Optical Communications Wireless Ltd. (Corning Incorporated)
• Inventors: Godali, David
• Granted Patent: US 9,231,701 B2
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: H04B 10/25753 Distribution optical network, e.g. between a base station and a plurality of remote units
• CPC Class Codes: H04W 84/12 WLAN [Wireless Local Area Networks]
• CPC Class Codes: H05K 7/20136 Forced ventilation, e.g. by fans H05K7/202 takes precedence
• CPC Class Codes: H10N 10/10 operating with only the Peltier or Seebeck effects

Abstract

Attenuation systems have cooling components that produce power in response to heat generated by the attenuator. The cooling components can be used to power cooling fans if a primary power source of the fans fails.

Claims

1. A communication system, comprising:

a signal source;

a system communicatively coupled to the signal source in order to receive signals from the source, the system including remote units configured to wirelessly transmit RF signals into a respective coverage area and to receive wireless RF signals from the coverage area; and

an attenuation system interposed between the signal source and the system to attenuate signals from the source, the attenuation system comprising;

an attenuator configured to attenuate signals;

a thermoelectric cooling component configured to absorb heat generated by the attenuator and to generate electrical current in response to the heat; and

a cooling device in electrical communication with the thermoelectric cooling component and arranged to cool the attenuator when powered by the thermoelectric cooling component.

2. The communication system of claim 1, wherein the thermoelectric cooling component comprises a plurality of thermoelectric modules configured to generate electrical current in response to heat flow.

3. The communication system of claim 2, wherein the thermoelectric modules comprise a first semiconductor of a first electron density and a second semiconductor of a second electron density different than the first electron density.

4. The communication system of claim 3, wherein the first semiconductor is a p-type semiconductor and the second semiconductor is an n-type semiconductor.

5. The communication system of claim 1, wherein the cooling device comprises at least one fan.

6. The communication system of claim 1, wherein the cooling device is coupled to a power source, and wherein the thermoelectric cooling component is configured to provide electric power to the cooling device when the power source fails.

7. The communication system of claim 1, wherein the signal source is a radio frequency (RF) signal source configured to provide RF signals to the system.

8. The communication system of claim 7, wherein the system is a distributed communication system comprising head end equipment communicatively coupled to the remote units configured to receive and distribute the RF signals.

9. The communication system of claim 1, wherein:

the thermoelectric cooling component comprises a plurality of thermoelectric modules configured to generate electrical current in response to heat flow, the thermoelectric modules comprising a first semiconductor of a first electron density and a second semiconductor of a second electron density different than the first electron density; and

the cooling device comprises at least one fan coupled to a power source, and wherein the thermoelectric cooling component is configured to provide electric power to the cooling device when the power source fails.

10. The communication system of claim 9, wherein:

the system is a distributed communication system comprising head end equipment communicatively coupled to the remote units configured to receive and distribute the RF signals; and

the signal source is a radio frequency (RF) signal source configured to provide downlink RF signals to the system and receive uplink signals from the head equipment.

11. A method of operating a communication system having an attenuation system comprising an attenuator configured to attenuate signals, a thermoelectric cooling component configured to absorb heat generated by the attenuator, and a cooling device in electrical communication with the thermoelectric cooling component and arranged to cool the attenuator, the method comprising:

providing a signal to the attenuation system;

attenuating the signal in the attenuation system so that the attenuator generates heat in response to attenuating the signal;

at the thermoelectric cooling component, generating an electrical current in response to the heat generation;

providing the electrical current to the cooling device; and

from a plurality of remote units, wirelessly transmitting signals into respective coverage areas.

12. The method of claim 11, wherein the thermoelectric cooling component comprises a plurality of thermoelectric modules configured to generate electrical current in response to heat flow.

13. The method of claim 12, wherein the thermoelectric modules comprise a first p-type semiconductor of a first electron density and a second n-type semiconductor of a second electron density different than the first electron density.

14. The method of claim 13, wherein the cooling device comprises at least one fan.

15. The method of claim 14, wherein the cooling device is coupled to a power source, and wherein providing electrical current to the cooling device occurs when the power source fails.

16. The method of claim 14, wherein providing a signal to the attenuation system comprises transmitting an RF signal.

17. The method of claim 14, further comprising providing the attenuated signals to a distributed communication comprising the remote units, and head end equipment configured to receive and distribute the attenuated signal to the remote units.

18. An attenuation system, comprising:

an attenuator configured to attenuate signals from a source;

a thermoelectric cooling component configured to absorb heat generated by the attenuator and to generate electrical current in response to the heat; and

a cooling device in electrical communication with the thermoelectric cooling component and arranged to cool the attenuator when powered by the thermoelectric cooling component.

19. The attenuation system of claim 18, wherein the source is an RF signal source.

20. The attenuation system of claim 18, wherein the thermoelectric cooling component comprises a plurality of thermoelectric modules configured to generate electrical current in response to heat flow.

21. The attenuation system of claim 20, wherein the thermoelectric modules comprise a first semiconductor of a first electron density and a second semiconductor of a second electron density different than the first electron density.

22. The attenuation system of claim 21, wherein the first semiconductor is a p-type semiconductor and the second semiconductor is an n-type semiconductor.

23. The attenuation system of claim 22, wherein the cooling device comprises a plurality of fans.

24. The attenuation system of claim 22, wherein the cooling device is coupled to a power source, and wherein the thermoelectric cooling component is configured to provide electric power to the cooling device when the power source fails.