Solder Powder
2 Assignments
0 Petitions
Accused Products
Abstract
The invention relates to a solder powder for connecting components made of aluminium or aluminium alloys by brazing, in particular a brazing powder for connecting heat exchanger components. The solder powder consists of powder particles on an aluminium-silicon base having a weight fraction of more than 12% by weight of silicon, wherein the powder particles have been produced by a rapid solidification and contain uniformly distributed silicon primary crystal precipitations in the eutectic aluminium-silicon alloy structure. Coating with such a solder powder leads to a uniform distribution of the silicon on the surface of the component coated with solder powder and thus to the same good soldering results.
8 Citations
32 Claims
-
1-16. -16. (canceled)
-
17. Solder powder for connection of components made of aluminum or aluminum alloys by brazing consisting of:
-
powder particles on an aluminum-silicon base with a weight fraction of more than 12 wt. % silicon, wherein the powder particles are produced by rapid solidification of a melt on an aluminum-silicon base at high cooldown rates, in particular of 103 to 107 K/s, the powder particles have a maximum particle size of 80 μ
m,the powder particles contain evenly distributed silicon primary crystal segregations in the eutectic aluminum-silicon alloy structure and the powder particles comprise no coarse silicon primary crystal segregations in the structure. - View Dependent Claims (18, 23, 24, 25, 26, 27, 29, 30, 31, 32)
-
Specification