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Multilayer High Voltage Isolation Barrier in an Integrated Circuit

  • US 20150069572A1
  • Filed: 09/12/2013
  • Published: 03/12/2015
  • Est. Priority Date: 09/12/2013
  • Status: Active Grant
First Claim
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1. A semiconductor package comprising:

  • a transformer formed within a multilayer dielectric laminate substrate, wherein the transformer comprises;

    a first inductor coil formed in one or more dielectric laminate layers of the substrate;

    a second inductor coil formed in one or more dielectric laminate layers of the multilayer substrate; and

    an isolation barrier comprising two or more dielectric laminate layers of the substrate positioned between the first inductor coil and the second inductor coil.

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