ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS

• US 20150070228A1
• Filed: 09/11/2013
• Published: 03/12/2015
• Est. Priority Date: 09/11/2013
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Gu, Xiaoxiong, Garcia, Alberto V., Liu, Duixian, Reynolds, Scott K.
• Granted Patent: US 9,819,098 B2
• Time in Patent Office: Days
• US Class Current: 343/727
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/085 Slot-line radiating ends
• CPC Class Codes: H01Q 19/30 the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
• CPC Class Codes: H01Q 25/00 Antennas or antenna systems providing at least two radiating patterns arrangements for changing or varying the orientation or the shape of the directional pattern H01Q3/00
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/26 with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength resonant loop antennas H01Q7/00

Abstract

Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mm Wave) frequency range with radiation in broadside and end-fire directions.

Claims

1. A package structure, comprising:

an antenna package comprising a first antenna, a first antenna feed line, a second antenna, and a second antenna feed line; and

an RFIC (radio frequency integrated circuit) chip mounted to the antenna package, wherein the first antenna is connected to the RFIC chip by the first antenna feed line and the second antenna is connected to the RFIC chip by the second antenna feed line, and wherein the first antenna provides broadside radiation and the second antenna provides end-fire radiation.

2. The package structure of claim 1, wherein the first and second antennas are disposed on a first side of the antenna package.

3. The package structure of claim 2, wherein the antenna package further comprises an antenna ground plane disposed on a second side of the antenna package, opposite the first side of the antenna package.

4. The package structure of claim 1, wherein the first antenna comprises a planar patch antenna.

5. The package structure of claim 1, wherein the first antenna is disposed on a first side of the antenna package and wherein the second antenna is disposed on second side of the antenna package, opposite the first side of the antenna package.

6. The package structure of claim 5, wherein at least a portion of the first antenna feed line is formed through the antenna package from the first side to the second side of the antenna package.

7. The package structure of claim 1, wherein the first antenna comprises a first radiating element to receive broadside radiation and a second radiating element to transmit broadside radiation.

8. The package structure of claim 1, wherein the second antenna comprises a first radiating element to receive end-fire radiation and a second radiating element to transmit end-fire radiation.

9. The package structure of claim 1, wherein one of the first antenna and the second antenna comprises a phased array antenna.

10. An antenna package, comprising:

a first substrate;

a second substrate bonded to the first substrate; and

an antenna ground plane disposed between the first and second substrates;

wherein the first substrate comprises a first antenna and the second substrate comprises a second antenna, and

wherein the first antenna is configured to provide broadside radiation and the second antenna is configured to provide end-fire radiation.

11. The antenna package of claim 10, wherein the first and second substrates are printed circuit boards.

12. The antenna package of claim 10, wherein first antenna comprises a planar patch radiating element.

13. The antenna package of claim 10, wherein the first antenna comprises a cavity filled antenna.

14. The antenna package of claim 10, wherein second antenna comprises a planar Yagi antenna.

15. The antenna package of claim 10, wherein the antenna ground plane is formed on a surface of the second substrate, and wherein the second antenna comprises a tapered slot antenna patterned in the antenna ground plane.

16. The antenna package of claim 10, wherein the second antenna comprises a planar dipole antenna.

17. The antenna package of claim 10, wherein the second antenna comprises a planar Vivaldi antenna.

18. The antenna package of claim 10, wherein the first antenna comprises a first radiating element to receive broadside radiation and a second radiating element to transmit broadside radiation, and wherein the second antenna comprises a first radiating element to receive end-fire radiation and a second radiating element to transmit end-fire radiation.

19. The antenna package of claim 10, wherein one of the first antenna and the second antenna comprises a phased array antenna.

20. A wireless communications device, comprising

an antenna package comprising a first antenna, a first antenna feed line, a second antenna, and a second antenna feed line;

an RFIC (radio frequency integrated circuit) chip mounted to the antenna package, wherein the first antenna is connected to the RFIC chip by the first antenna feed line and the second antenna is connected to the RFIC chip by the second antenna feed line, and wherein the first antenna provides broadside radiation and the second antenna provides end-fire radiation; and

an application board, wherein the antenna package is mounted to the application board such that a portion of the antenna package having the second antenna is disposed at a distance past an edge of the application board.