POWER SUPPLY DEVICE

• US 20150070845A1
• Filed: 09/04/2014
• Published: 03/12/2015
• Est. Priority Date: 09/06/2013
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: HARA, Yasuhiro, NAKAHORI, Wataru, MIYAZAKI, Hiroshi, SANAE, Haruhiko
• Granted Patent: US 9,445,525 B2
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

In a power supply device 1, a first space R1 and a second space R2 are delimited, a coil component 20 is arranged in the first space R1, and heat-generating components and components having weak resistance to heat are arranged in the second space R2. The power supply device 1 is configured to contain the coil component 20 in the first space R1 so that ambient air of the coil component 20 can contact a first side wall 72, which constitutes the first space R1, making it possible to expect discharge of heat to coolant in a coolant channel W via the first side wall 72. Therefore, heat can be discharged from the ambient air of the coil component, the temperature of which has been raised by heat generation, towards the coolant efficiently.

Claims

1. A power supply device comprising:

a housing having a first bottom surface, a first side wall extending upwards from a peripheral edge of the first bottom surface, a second bottom surface provided on the first side wall above the first bottom surface, a second side wall extending upwards from a peripheral edge of the second bottom surface, and a coolant channel provided below the second bottom surface so that coolant flows through the coolant channel;

a main substrate contained in an interior of the housing, wherein electronic components provided on a first main surface and a part of a second main surface, which is opposite the first main surface, being arranged on the second bottom surface of the housing while facing the second bottom surface; and

a coil component contained in the interior of the housing and electrically connected to the main substrate, wherein the interior of the housing is delimited into a first space surrounded by the first bottom surface and the first side wall, and a second space provided above the first space and surrounded by the second bottom surface and the second side wall,

the coil component is arranged in the first space, and

the electronic components provided on the first main surface of the main substrate are arranged in the second space.

2. The power supply device according to claim 1, wherein the first space and the second space are delimited by the main substrate.

3. The power supply device according to claim 1, wherein the first space and the second space are delimited by a heat shield plate, and

the main substrate is arranged on a side of the second space.

4. The power supply device according to claim 1, wherein the electronic components are heat-generating components and components having weak resistance to heat.

5. The power supply device according to claim 3, wherein the heat shield plate is provided at the substantially same height as the second bottom surface or below the second bottom surface.

6. The power supply device according to claim 3, wherein the heat shield plate has an opening near its peripheral edge so that a connection member, which connects the coil component and the main substrate, extends through the opening.

7. The power supply device according to claim 1, wherein the heat shield plate has a pressing member on its lower surface side to fix the coil component.

8. The power supply device according to claim 1, wherein the coolant channel is provided along the first side wall above the first bottom surface.

9. The power supply device according to claim 1, wherein lower surfaces of the electronic components provided on the first main surface of the main substrate are arranged on the second bottom surface of the housing so that heat is discharged to the coolant channel.

10. The power supply device according to claim 5, wherein the heat shield plate has an opening near its peripheral edge so that a connection member, which connects the coil component and the main substrate, extends through the opening.