RADIATION-EMITTING COMPONENT, TRANSPARENT MATERIAL AND FILLER PARTICLES, AND METHOD OF PRODUCING SAME

• US 20150076544A1
• Filed: 04/05/2013
• Published: 03/19/2015
• Est. Priority Date: 04/12/2012
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Kruppa, Michael, Braune, Bert, Schmidtke, Kathy
• Granted Patent: US 9,748,451 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: C08G 77/395 containing phosphorus
• CPC Class Codes: C08G 79/04 Phosphorus linked to oxygen or to oxygen and carbon
• CPC Class Codes: C08K 2003/2227 of aluminium
• CPC Class Codes: C08K 2003/2241 Titanium dioxide
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08K 5/52 Phosphorus bound to oxygen only
• CPC Class Codes: C08K 5/5317 Phosphonic compounds, e.g. R—P(:O)(OR')2
• CPC Class Codes: C08K 5/5333 Esters of phosphonic acids
• CPC Class Codes: C08K 5/5406 containing elements other than oxygen or nitrogen
• CPC Class Codes: C08K 5/56 Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
• CPC Class Codes: C09C 1/3607 Titanium dioxide
• CPC Class Codes: C09C 1/3653 Treatment with inorganic compounds
• CPC Class Codes: C09C 1/3669 Treatment with low-molecular organic compounds
• CPC Class Codes: C09C 1/3676 Treatment with macro-molecular organic compounds
• CPC Class Codes: C09C 1/407 Aluminium oxides or hydroxides
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2933/0041 : relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 2933/0058 : relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0075 : relating to heat extraction or cooling elements
• CPC Class Codes: H01L 2933/0091 : Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/641 : characterized by the materials
• CPC Class Codes: H01L 33/644 : in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

A radiation-emitting component includes a radiation source; a transparent material disposed in the beam path of the component and including a polymer material and filler particles, wherein the filler particles include an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and through which the filler particles are crosslinked with the polymer material.

Claims

1-16. -16. (canceled)

17. A radiation-emitting component comprising:

a radiation source;

a transparent material disposed in the beam path of the component and comprises a polymer material and filler particles;

wherein the filler particles comprise an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and through which the filler particles are crosslinked with the polymer material,

wherein the transparent material is obtained by crosslinking the filler particles with the polymer material, and reacting the polymer material with a phosphonic acid derivative or a phosphoric acid derivative having a structure represented by Formulae Ia and/or Ib

18. The component according to claim 17,

wherein, in Formulae Ia and Ib, [X]_n-FG in the P—

[X]_n-FG fragment is at least one selected from the group consisting of vinyl, allyl, epoxyethyl, glycidyl, O-vinyl, O-glycidyl,

19. The component according to claim 17, wherein the polymer material comprises a silicone, an epoxy resin, a silicone-epoxide hybrid material or a combination thereof.

20. The component according to claim 19, wherein the transparent material is obtained by crosslinking the filler particles with the polymer material, and reacting a functional group Y of the polymer material selected from the group consisting of Si—

H, Si—

OH and alkylene-OH with a crosslinkable group or a leaving group FG of the phosphonic acid derivative or phosphoric acid derivative, the phosphonic acid derivative or phosphoric acid derivative having a structure which is represented by Formulae Ia and/or Ib.

21. The component according to claim 17, wherein the phosphonic acid derivative or phosphoric acid derivative through which the polymer material is crosslinked with the filler particles in the transparent material has a structure represented by Formulae IIa and/or IIb

22. The component according to claim 17, wherein the inorganic filler material comprises a diffuser, a heat-conducting metal oxide, a converter material or a combination thereof.

23. A process of producing a transparent material, comprising:

A) providing a polymer material;

B) providing filler particles comprising an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof;

C) producing a mixture comprising the polymer material and the filler particles;

D) curing the mixture by crosslinking the polymer material with the filler particles via the attached phosphonic acid derivative or phosphoric acid derivative to obtain the transparent material.

24. The process according to claim 23, wherein the filler particles in step B) comprise a phosphonic acid derivative or phosphoric acid derivative attached to the surface thereof, having a structure represented by Formulae Ia and/or Ib

25. The process according to claim 23, wherein providing the filler particles in step B) comprises:

B1) providing the inorganic filler material;

B2) applying a composition to the inorganic filler material, said composition comprising a solvent and a phosphonic acid derivative or a phosphoric acid derivative, said phosphonic acid derivative or phosphoric acid derivative having a structure represented by the Formula III

26. The process according to claim 23, wherein providing the filler particles in step B) comprises:

B1) providing the inorganic filler material;

B2) applying a composition to the inorganic filler material, said composition comprising a solvent and a phosphonic acid derivative or a phosphoric acid derivative, said phosphonic acid derivative or phosphoric acid derivative having a structure represented by the Formula III

27. The process according to claim 23, further comprising:

A0) providing a radiation source, and

B0) producing a transparent material in a beam path of the component.

29. The process according to claim 27, wherein the transparent material comprises a polymer material and filler particles,

wherein the filler particles comprise an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and through which the filler particles are crosslinked with the polymer material.

28. Filler particles comprising an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof, having a structure represented by the Formulae Ia and/or Ib