Integrated Fan-Out Package Structures with Recesses in Molding Compound

• US 20150076713A1
• Filed: 09/13/2013
• Published: 03/19/2015
• Est. Priority Date: 09/13/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Tsai, Po-Hao, Cheng, Li-Hui, Hung, Jui-Pin, Lin, Jing-Cheng
• Granted Patent: US 9,142,432 B2
• Time in Patent Office: Days
• US Class Current: 257/782
• CPC Class Codes: H01L 21/31053 involving a dielectric removal step
• CPC Class Codes: H01L 21/311 Etching the insulating layers by chemical or physical means H01L21/31058 takes precedence
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68372 used to support a device or wafer when forming electrical connections thereto when forming bonding pads H01L24/03; when forming bump connectors H01L24/11; when forming layer connectors H01L24/27
• CPC Class Codes: H01L 2224/02205 Structure of the protective coating
• CPC Class Codes: H01L 2224/0231 Manufacturing methods of the redistribution layers
• CPC Class Codes: H01L 2224/02379 Fan-out arrangement
• CPC Class Codes: H01L 2224/0239 Material of the redistribution layers
• CPC Class Codes: H01L 2224/024 Material of the insulating layers therebetween
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05025 : the internal layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05124 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/11334 : using preformed bumps
• CPC Class Codes: H01L 2224/1146 : Plating
• CPC Class Codes: H01L 2224/11849 : Reflowing
• CPC Class Codes: H01L 2224/12105 : Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/13026 : relative to the bonding area, e.g. bond pad, of the semiconductor or solid-state body
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/02 : Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/04642 : SiC
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/05442 : SiO2
• CPC Class Codes: H01L 2924/0549 : being a combination of two or more materials provided in the groups H01L2924/0531 - H01L2924/0546
• CPC Class Codes: H01L 2924/07025 : Polyimide
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/1027 : IV
• CPC Class Codes: H01L 2924/1032 : III-V
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1432 : Central processing unit [CPU]
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

A package includes a first die and a second die. The first die includes a first substrate and a first metal pad overlying the first substrate. The second die includes a second substrate and a second metal pad overlying the second substrate. A molding compound molds the first die and the second die therein. The molding compound has a first portion between the first die and the second die, and a second portion, which may form a ring encircles the first portion. The first portion and the second portion are on opposite sides of the first die. The first portion has a first top surface. The second portion has a second top surface higher than the first top surface.

Claims

1. A package comprising:

a first die comprising a first substrate and a first metal pad overlying the first substrate;

a second die comprising a second substrate; and

a molding compound molding the first die and the second die therein, wherein the molding compound comprises;

a first portion between the first die and the second die, wherein the first portion comprises a first top surface; and

a second portion, wherein the first portion and the second portion are on opposite sides of the first die, and wherein the second portion has a second top surface higher than the first top surface.

2. The package of claim 1, wherein the second portion of the molding compound is comprised in a ring portion of the molding compound, wherein the ring portion encircles the first portion of the molding compound, the first die, and the second die, and wherein all top surface of the ring portion is coplanar with the second top surface.

3. The package of claim 1, wherein a height different between the first top surface and the second top surface is between about 2 μ

m and about 35 μ

m.

4. The package of claim 1, wherein the first die further comprises:

a passivation layer covering edge portions of the first metal pad, with a center portion of the first metal pad un-covered by the passivation layer, wherein the first top surface is substantially level with a top surface of the passivation layer.

5. The package of claim 1, wherein the first die further comprises:

a passivation layer covering edge portions of the first metal pad, with a center portion of the first metal pad un-covered by the passivation layer, wherein the first top surface is higher than a top surface of the passivation layer.

6. The package of claim 1, wherein the first die further comprises:

a passivation layer covering edge portions of the first metal pad, with a center portion of the first metal pad un-covered by the passivation layer, wherein the first top surface is lower than a top surface of the passivation layer.

7. The package of claim 1 further comprising:

a polymer layer continuously extending from a region overlapping the first die into a region overlapping the second die, wherein the first top surface is in contact with a bottom surface of the polymer layer;

a first redistribution line penetrating through the polymer layer to electrically couple to the first metal pad;

a second metal pad in the second die and over the second substrate; and

a second redistribution line penetrating through the polymer layer to electrically couple to the second metal pad.

8. A package comprising:

a first die comprising;

a first substrate;

a first metal pad over the first substrate; and

a first passivation layer covering edge portions of the first metal pad, with a center portion of the first metal pad un-covered by the first passivation layer, wherein the first passivation layer comprises a first top surface;

a second die comprising;

a second substrate;

a second metal pad over the second substrate; and

a second passivation layer covering edge portions of the second metal pad, with a center portion of the second metal pad un-covered by the second passivation layer, wherein the second passivation layer comprises a second top surface;

a molding compound molding the first die and the second die therein, wherein the molding compound comprises;

a first portion between the first die and the second die, wherein the first portion comprises a third top surface; and

a second portion forming a ring surrounding the first portion of the molding compound, the first die, and the second die, wherein the second portion has a fourth top surface higher than the third top surface.

9. The package of claim 8, wherein two opposite ends of the first portion of the molding compound are continuously connected to the second portion of the molding compound, and wherein the first portion and the second portion are formed of as a same material.

10. The package of claim 8, wherein the third top surface is level with or lower than one of the first top surface and the second top surface.

11. The package of claim 8 further comprising:

a polymer layer continuously extending from a region overlapping the first die into a region overlapping the second die, wherein the third top surface is in contact with a bottom surface of the polymer layer;

a first redistribution line penetrating through the polymer layer to electrically couple to the first metal pad; and

a second redistribution line penetrating through the polymer layer to electrically couple to the second metal pad.

12. The package of claim 11, wherein the first top surface and the second top surface are in contact with the bottom surface of the polymer layer.

13. The package of claim 8, wherein the first die and the second die have different structures.

14. The package of claim 8, wherein the fourth top surface is higher than the third top surface by a difference between about 2 μ

m and about 35 μ

m.

15. A method comprising:

placing a first die over a carrier, wherein the first die comprises a first substrate and a first metal pad over the first substrate;

placing a second die over the carrier, wherein the second die comprises a second substrate and a second metal pad over the second substrate;

molding the first die and the second die in a molding compound;

grinding the molding compound;

after the grinding, recessing a first portion of the molding compound, wherein the first portion is between the first die and the second die, and wherein a second portion of the molding compound is not recessed; and

forming redistribution lines over and electrically coupled to the first metal pad and the second metal pad.

16. The method of claim 15, wherein the recessing is performed through laser drilling.

17. The method of claim 15, wherein after the recessing, a bottom portion of the first portion of the molding compound is left un-removed.

18. The method of claim 15, wherein the first die and the second die are covered by a first protection film and a second protection film, respectively, wherein the grinding is stopped when the first protection film and the second protection film are exposed, and wherein the method further comprises:

after the grinding, removing the first protection film and a second protection film to expose the first die and the second die, respectively, wherein the first metal pad and the second metal pad are exposed after the removing.

19. The method of claim 15 further comprising:

after forming the redistribution lines, forming electrical connectors over and electrically coupled to the redistribution lines; and

performing a die saw to form a package comprising the first die, the second die, and the first and the second portions of the molding compound.

20. The method of claim 15 further comprising de-bonding the first die, the second die, and the molding compound from the carrier.