HYBRID RESONATORS IN MULTILAYER SUBSTRATES AND FILTERS BASED ON THESE RESONATORS
First Claim
1. A filter comprising:
- a multilayer substrate including a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other;
a first terminal disposed in one of said plurality of conductor layers;
a second terminal disposed in said one conductor layer;
a ground conductor disposed in said one conductor layer; and
a hybrid resonator disposed in said multilayer substrate,wherein said hybrid resonator comprises;
a first resonant element;
a second resonant element; and
a coupling strip configured to connect said first and said second resonant elements,wherein said first resonant element comprises;
a first signal via disposed through said multilayer substrate;
a first group of ground vias disposed through said multilayer substrate and configured to surround said first signal via; and
a first artificial dielectric disposed in said multilayer substrate and between said first signal via and said first group of ground vias,wherein said first artificial dielectric comprises;
a first conductive plate connected to said first signal via; and
a first isolating slit configured to isolate said first conductive plate from said first group of ground vias,wherein said second resonant element comprises;
a second signal via disposed through said multilayer substrate;
a second group of ground vias disposed through said multilayer substrate and configured to surround said second signal via; and
a second artificial dielectric disposed in said multilayer substrate and between said second signal via and said second group of ground vias, andwherein said second artificial dielectric comprises;
a second conductive plate connected to said second signal via; and
a second isolating slit configured to isolate said second conductive plate from said second group of ground vias; and
wherein said first terminal and said second terminal are connected to said coupling strip.
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0 Petitions
Accused Products
Abstract
A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias. The artificial dielectric comprises a conductive plate connected to the first signal via and an isolating slit isolating the first conductive plate from the group of ground vias.
9 Citations
13 Claims
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1. A filter comprising:
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a multilayer substrate including a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other; a first terminal disposed in one of said plurality of conductor layers; a second terminal disposed in said one conductor layer; a ground conductor disposed in said one conductor layer; and a hybrid resonator disposed in said multilayer substrate, wherein said hybrid resonator comprises; a first resonant element; a second resonant element; and a coupling strip configured to connect said first and said second resonant elements, wherein said first resonant element comprises; a first signal via disposed through said multilayer substrate; a first group of ground vias disposed through said multilayer substrate and configured to surround said first signal via; and a first artificial dielectric disposed in said multilayer substrate and between said first signal via and said first group of ground vias, wherein said first artificial dielectric comprises; a first conductive plate connected to said first signal via; and a first isolating slit configured to isolate said first conductive plate from said first group of ground vias, wherein said second resonant element comprises; a second signal via disposed through said multilayer substrate; a second group of ground vias disposed through said multilayer substrate and configured to surround said second signal via; and a second artificial dielectric disposed in said multilayer substrate and between said second signal via and said second group of ground vias, and wherein said second artificial dielectric comprises; a second conductive plate connected to said second signal via; and a second isolating slit configured to isolate said second conductive plate from said second group of ground vias; and wherein said first terminal and said second terminal are connected to said coupling strip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification