DEPOSITED THREE-DIMENSIONAL ANTENNA APPARATUS AND METHODS

• US 20150077292A1
• Filed: 09/19/2013
• Published: 03/19/2015
• Est. Priority Date: 09/19/2013
• Status: Abandoned Application

• Current Assignee: Pulse Finland Oy (Yageo Corporation)
• Original Assignee: Pulse Finland Oy (Yageo Corporation)
• Inventors: Kalistaja, Esa
• Application Number:
  US14/031,646
• Publication Number:
  US 20150077292A1
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00
• CPC Class Codes: H01Q 5/371 Branching current paths
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

A “thin” and cost-effective three-dimensional antenna assembly and methods of use and manufacturing thereof. In one exemplary embodiment, the solution of the present disclosure is particularly adapted for small form-factor portable radio devices, and comprises an antenna (or array of antennas) deposited on a thin preformed flexible or deformable structure using a conductive fluid. The antenna (array) includes one or more antennas each having a radiator and a plurality of contacts. Use of the thin preformed structure allows, among other things, thinner form factors for the host wireless device, and obviates use of a separate molded carrier or other more costly or involved processes (such as laser direct structuring).

Claims

1. An antenna assembly for use in a compact form factor mobile device, comprising:

a preformed thin flexible structure; and

an antenna comprising a radiator and a plurality of contacts;

wherein said antenna radiator and said plurality of contacts are deposited on said flexible structure using a flowable conductive fluid.

2. The antenna assembly of claim 1, wherein the preformed flexible structure permits the antenna assembly to conform to one or more three-dimensional features present within the mobile device.

3. The antenna assembly of claim 2, wherein the conformance of the antenna assembly to the three-dimensional features comprises at least one angular bend in the flexible structure corresponding to at least one internal feature of the mobile device.

4. The antenna assembly of claim 1, wherein the preformed flexible structure comprises a first side, second side, and an edge, and the radiator is formed over at least a portion of the edge such that the radiator extends from the first side to the second side.

5. The antenna assembly of claim 1, wherein at least the radiator and the plurality of contacts have been cured using a curing process for the flowable conductive fluid.

6. The antenna assembly of claim 5, wherein the curing process for the flowable conductive fluid is selected so as to mitigate damage to the flexible structure by the curing process.

7. The antenna assembly of claim 1, wherein the flexible structure comprises a plurality of apertures formed therethrough, the plurality of contacts are disposed on at least a first side of the flexible structure, the radiator is disposed at least one a second side of the flexible structure, and the radiator and the plurality of contacts are electrically connected with one another via at least conductive fluid disposed within the apertures.

8. A method of reducing risk of loss in a manufacturing process of a wireless device, the method comprising:

providing a low-cost substantially flexible substrate; and

disposing a first antenna radiator on the substrate using a deposition process so as to form an antenna for use with at least one wireless interface of the wireless device;

wherein provision of the substrate and formation of the antenna reduce a cost associated with a failure of the antenna or wireless device to pass subsequent testing or inspection.

9. The method of claim 8, wherein the cost reduction comprises a cost reduction relative to deposition of the first antenna radiator on a housing component of the wireless device, the housing component having a significantly higher cost than a cost of the flexible substrate.

10. The method of claim 8, wherein the wireless device comprises a thin form-factor wireless device that is not amenable to use of a molded antenna carrier.

11. The method of claim 8, wherein the method further comprises:

curing the first radiator using a curing process;

disposing a second antenna radiator useful for a different wireless interface or frequency band from that of the first antenna radiator on the substantially flexible substrate; and

curing the second radiator using a curing process.

12. The method of claim 11, wherein a probability of the antenna or wireless device with both first and second radiators failing to pass the subsequent testing or inspection is higher than that for the disposition of only the first antenna radiator due to additional process steps associated with the disposition of the second radiator and the curing thereof.

13. A thin form-factor wireless mobile device, comprising:

a housing;

at least one wireless transceiver, and

an antenna assembly in signal communication with the at least one wireless transceiver, the antenna assembly comprising;

a thin flexible structure; and

an antenna comprising a radiator and a plurality of contacts;

wherein said antenna radiator and said plurality of contacts are deposited on said plastic structure using a flowable conductive fluid.

14. The mobile device of claim 13, wherein:

the thin form-factor of the mobile device is thinner than that achievable using a substantially inflexible molded antenna carrier assembly; and

the deposition of the radiator on the flexible structure provides a lower cost of manufacturing than deposition of the radiator on the housing.

15. The mobile device of claim 14, wherein the lower cost of manufacturing results at least in part from a cost differential between the flexible structure and at least a portion of the housing.

16. The mobile device of claim 13, wherein use of the thin flexible structure and the deposition of the radiator thereon obviates a need for a more costly structure suitable for a laser direct structuring (LDS) process.

17. An antenna assembly for use in a compact form factor mobile device, comprising:

a first thin flexible structure having a first antenna comprising a radiator and a first plurality of contacts disposed thereon; and

a second thin flexible structure having a second antenna comprising a radiator and a second plurality of contacts disposed thereon;

wherein said first and second radiators and the first and second contacts are deposited on said first and second structures, respectively using a flowable conductive fluid; and

wherein said first and second structures are substantially stacked with respect to one another.

18. The assembly of claim 17, wherein the first and second thin flexible structures are preformed into desired first and second shapes, respectively.

19. The assembly of claim 18, wherein the desired first and second shapes correspond to one or more internal features or components of a host device within which the assembly is to be used.