LED MODULE, LIGHTING DEVICE, AND LAMP
2 Assignments
0 Petitions
Accused Products
Abstract
An LED module includes: an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the LED chip to patterned wiring circuit. In the LED module, the first bond and the second bond each allow light emitted from the LED chip to pass therethrough. The submount is a light-transmissive member. A lighting device includes a device main body and the LED module. The lamp includes the LED module.
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Citations
28 Claims
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1-14. -14. (canceled)
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15. An LED module comprising:
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an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the LED chip to the wiring circuit, the first bond and the second bond each allowing light emitted from the LED chip to pass therethrough, the submount being a light-transmissive member, the LED chip including; a LED structure portion including a n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer; and a substrate being transparent to light emitted from the light-emitting layer, the LED structure portion provided on a main surface of the substrate, the substrate being situated closer to the light-transmissive member than the LED structure portion, the light-transmissive member having a planar size greater than a planar size of the LED chip, and the transparent member allowing parts of the light emitted from the light-emitting layer of the LED chip towards the transparent member to be diffused in the light-transmissive member and emerge from the light-transmissive member through the face and/or side faces. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification