MICRO-INTEGRATABLE TUNABLE LASER ASSEMBLY

• US 20150078408A1
• Filed: 05/23/2013
• Published: 03/19/2015
• Est. Priority Date: 05/23/2013
• Status: Active Grant

• Current Assignee: NeoPhotonics Corporation (Lumentum Holdings Inc.)
• Original Assignee: Emcore Corporation
• Inventors: Bukkems, Heino
• Granted Patent: US 9,178,331 B2
• Time in Patent Office: Days
• US Class Current: 372/20
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: H01S 3/1003 tunable optical elements, e.g. acousto-optic filters, tunable gratings

Abstract

According to an embodiment of the invention, there is provided a micro integratable tunable laser assembly (m-ITLA) which includes an electrical interface for interfacing with a host, a tunable laser module for conducting optical communication, and a control unit, for at least controlling operation of the tunable laser module according to information received from the host via the electrical interface. The m-ITLA can have a length of about 37 mm or less and a width of about 20 mm or less.

Claims

1. A micro integratable tunable laser assembly (m-ITLA), characterized in that the m-ITLA comprises:

an electrical interface for interfacing with a host;

a tunable laser module for irradiating a laser light;

a control unit, for at least controlling the tunable laser module according to information received from the host via the electrical interface;

a dual-sided printed circuit board (PCB) defining first openings, wherein each of the electrical interface, the tunable laser module, and the control unit is mounted onto either side of the PCB;

a first plate defining first projections;

a second plate defining second projections; and

a pad provided between the tunable laser module and at least a portion of the first and second plates, the pad being adaptable to be compressed,

wherein the first openings are corresponding to the respective first projections and the respective second projections,

wherein the PCB is adaptable to be retained between the first and second plates by the first and second projections when the first and second plates are secured to each other,

wherein the pad is adaptable to hold the tunable laser module and/or to dissipate heat from the tunable laser module, and

wherein the m-ITLA has a length of about 37 mm or less and a width of about 20 mm or less.

2. The micro integratable tunable laser assembly according to claim 1, characterized in that the control unit comprises:

a receiving path for receiving information from the electrical interface;

a transmitting path for transmitting information to the electrical interface;

a driving unit for driving the tunable laser module; and

a processing unit adaptable for processing information received from the receiving path, controlling the driving unit according to the information received from the receiving path to drive the tunable laser module, and obtaining the information to be transmitted by the transmitting path from the processing and the controlling.

3. The micro integratable tunable laser assembly according to claim 2, characterized in that the control unit further comprises:

a set of registers, at least a part of which are capable of being set by the processing unit according to the processing and the controlling thereof,

wherein the driving unit is capable of driving the tunable laser module according to contents set in one or more of the set of registers under the control of the processing unit.

4. The micro integratable tunable laser assembly according to claim 2, characterized in that the information received from the electrical interface comprises one or more frames, each at least including a packet carrying a command, and the information transmitted to the electrical interface comprises one or more frames, each at least including a packet carrying a response to a command.

5. The micro integratable tunable laser assembly according to claim 2, characterized in that the receiving path comprises:

a decoder unit for decoding the received information from the electrical interface into one or more frames; and

a de-frame unit for de-framing the one or more frames into a packet.

6. The micro integratable tunable laser assembly according to claim 2, characterized in that the transmitting path comprises:

a frame unit for framing a packet into a frame; and

an encoder unit for encoding the frame so as to be transmitted via the electrical interface.

7. The micro integratable tunable laser assembly according to claim 1, wherein the micro integratable tunable laser assembly has a height of about 8 mm or less.

10. The integratable tunable laser assembly according to claim 1,

wherein said any of the first plate and the second plate has a recess for at least partly receiving the pad,

wherein a depth of the recess is less than a height of the pad, prior to compressing of the pad, and

wherein the tunable laser module is adaptable to be supported by a surface of said any of the first plate and the second plate, and in close contact with the pad which is compressed into the recess, after the securing.

11. The micro integratable tunable laser assembly according to claim 10,

wherein the recess comprises a first cavity and a second cavity over and adjoined to the first cavity, the second cavity having in-plane dimensions larger than those of the first cavity so that a step is formed at side surfaces of the recess,

wherein a depth of the first cavity of the recess is less than the height of the pad, prior to the compressing of the pad, and

wherein the tunable laser module is adaptable to be fitted in the second cavity and supported by the step of the recess, and in close contact with the pad which is compressed into the first cavity of the recess, after the securing.

12. The micro integratable tunable laser assembly according to claim 1,

wherein the tunable laser module is mounted to the printed circuit board in a non-flexible manner.

13. The micro integratable tunable laser assembly according to claim 1,

wherein each of the first projections includes a first mounting through-hole, each of the second projections includes a second mounting through-hole, and each of the second mounting through-holes being aligned with each of the first mounting through-holes,

wherein the first openings are aligned with the respective first mounting through-holes and the respective second mounting through-holes, and

the micro integratable tunable laser assembly further comprises:

a retention screw adaptable to be screwed into at least one of the respective first mounting through-hole and the respective second mounting through-hole, which has screw threads on a wall thereof, to secure the first plate and the second plate.

14. The micro integratable tunable laser assembly according to claim 13,

wherein the retention screw includes a third mounting through-hole so that the Micro integratable tunable laser assembly is adaptable to be mounted to an external object through the third mounting through-hole of the retention screw.

15. The micro integratable tunable laser assembly according to claim 14,

wherein the retention screw includes a first portion and a second portion having threads on an outer-surface thereof, the first portion having an outer diameter greater than that of the second portion, and the third mounting through-hole penetrates the first portion and the second portion longitudinally, and

wherein the first mounting through-hole includes a first portion and a second portion, the first portion having a inner diameter greater than that of the second portion, so that the first portion of the retention screw can be seated on the second portion of the first mounting through-hole in the case that the first plate and the second plate are screwed by the retention screw.

8-9. -9. (canceled)