ACOUSTIC TRANSDUCER AND MICROPHONE

• US 20150078592A1
• Filed: 09/10/2014
• Published: 03/19/2015
• Est. Priority Date: 09/13/2013
• Status: Active Grant

• Current Assignee: MMI Semiconductor Company Limited (MinebeaMitsumi Inc.)
• Original Assignee: Omron Corporation
• Inventors: Uchida, Yuki
• Granted Patent: US 9,544,697 B2
• Time in Patent Office: Days
• US Class Current: 381/191
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

An acoustic transducer has a substrate having a cavity, a vibrating electrode plate disposed above the substrate and having a void portion that allows pressure to escape, a fixed electrode plate disposed above the substrate opposite the vibrating electrode plate, and a leak pressure regulation portion that hinders leakage of air pressure by passing through the void portion when the vibrating electrode plate is not undergoing deformation, and that becomes separated from the void portion and allows pressure to escape by passing through the void portion when the vibrating electrode plate undergoes deformation from being subjected to pressure.

Claims

1. An acoustic transducer comprising:

a substrate having a cavity;

a vibrating electrode plate disposed above the substrate and having a void portion that allows pressure to escape;

a fixed electrode plate disposed above the substrate opposite the vibrating electrode plate; and

a leak pressure regulation portion that hinders leakage of air pressure by passing through the void portion when the vibrating electrode plate is not undergoing deformation, and that becomes separated from the void portion and allows pressure to escape by passing through the void portion when the vibrating electrode plate undergoes deformation from being subjected to pressure.

2. The acoustic transducer according to claim 1, wherein the void portion is an opening formed in the vibrating electrode plate.

3. The acoustic transducer according to claim 2, wherein the leak pressure regulation portion is a plate-shaped member that is accommodated in the opening in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation.

4. The acoustic transducer according to claim 1, wherein the leak pressure regulation portion is disposed opposite to an upper side or a lower side of the vibrating electrode plate to block one of an upper opening and a lower opening of the void portion in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation.

5. The acoustic transducer according to claim 4, wherein the leak pressure regulation portion is an upper surface of a portion of the substrate that is positioned to block the lower opening of the void portion in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation.

6. The acoustic transducer according to claim 1, wherein the void portion is a recession that is formed in an edge of the vibrating electrode plate and is recessed toward the interior of the vibrating electrode plate.

7. The acoustic transducer according to claim 6, wherein the leak pressure regulation portion is a plate-shaped member that is located in the recession in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation.

8. The acoustic transducer according to claim 1,

wherein the leak pressure regulation portion is positioned in the void portion in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation, and

wherein a slit is formed between an edge of the leak pressure regulation portion and an edge of the void portion.

9. The acoustic transducer according to claim 8, wherein the width of the slit is less than or equal to 10 μ

m.

10. The acoustic transducer according to claim 1,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate,

wherein a support portion is disposed on a surface of the back plate opposite the vibrating electrode plate, and

wherein the leak pressure regulation portion is fixed to the support portion.

11. The acoustic transducer according to claim 10, wherein the horizontal cross-sectional area of the support portion is smaller than the area of the leak pressure regulation portion.

12. The acoustic transducer according to claim 10, wherein the leak pressure regulation portion is supported by a plurality of support portions.

13. The acoustic transducer according to claim 12, wherein a through-hole is disposed in the back plate between adjacent support portions.

14. The acoustic transducer according to claim 1, wherein the leak pressure regulation portion is fixed to a support portion provided on an upper surface of the substrate.

15. The acoustic transducer according to claim 1,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate,

wherein the fixed electrode plate is disposed on the back plate opposite the vibrating electrode plate,

wherein a plurality of acoustic holes are formed in the back plate and the fixed electrode plate, and

wherein a portion of the acoustic holes are overlapped with the void portion in a view from a direction perpendicular to the upper surface of the substrate.

16. The acoustic transducer according to claim 8,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate,

wherein the fixed electrode plate is disposed on the back plate opposite the vibrating electrode plate,

wherein a plurality of acoustic holes are formed in the back plate and the fixed electrode plate, and

wherein a portion of the acoustic holes are overlapped with the slit in a view from a direction perpendicular to the upper surface of the substrate.

17. The acoustic transducer according to claim 1,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate,

wherein the fixed electrode plate is disposed on the back plate opposite the vibrating electrode plate,

wherein a plurality of acoustic holes are formed in the back plate and the fixed electrode plate, and

wherein the width of the leak pressure regulation portion is greater than the distance between adjacent acoustic holes in a view from a direction perpendicular to the upper surface of the substrate.

18. The acoustic transducer according to claim 1,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate, and

wherein the fixed electrode plate is disposed on the back plate so as to oppose the vibrating electrode plate and to not oppose the leak pressure regulation portion.

19. The acoustic transducer according to claim 1,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate, and

wherein a protrusion is disposed on the back plate so as to oppose a region of the vibrating electrode plate that is adjacent to the void portion.

20. The acoustic transducer according to claim 1, wherein the void portion is disposed in a region where the amount of deformation of the vibrating electrode plate is large.

21. The acoustic transducer according to claim 1, wherein the vibrating electrode plate and the leak pressure regulation portion are formed from a same material and have a same thickness.

22. The acoustic transducer according to claim 21, wherein the leak pressure regulation portion and the vibrating electrode plate having the void portion are formed by forming a thin film over the substrate and dividing the thin film with a slit in a manufacturing process.

23. A microphone comprising:

the acoustic transducer according to claim 1; and

a circuit portion that amplifies a signal from the acoustic transducer and outputs the amplified signal to the outside.