WOUND DRESSING CONTAINING POLYSACCHARIDE AND COLLAGEN

• US 20150080815A1
• Filed: 09/19/2013
• Published: 03/19/2015
• Est. Priority Date: 09/19/2013
• Status: Active Grant

• Current Assignee: Medline Industries Incorporated (Medline Holdings Incorporated)
• Original Assignee: Medline Industries Incorporated (Medline Holdings Incorporated)
• Inventors: Chakravarthy, Debashish, Ford, Andrew J.
• Granted Patent: US 10,342,891 B2
• Time in Patent Office: Days
• US Class Current: 604/304
• CPC Class Codes: A61L 15/18 containing inorganic materials
• CPC Class Codes: A61L 15/325 Collagen
• CPC Class Codes: A61L 15/40 containing ingredients of undetermined constitution or reaction products thereof , e.g. plant or animal extracts
• CPC Class Codes: A61L 15/44 Medicaments
• CPC Class Codes: A61L 2300/404 Biocides, antimicrobial agents, antiseptic agents
• CPC Class Codes: A61L 2300/41 Anti-inflammatory agents, e.g. NSAIDs
• CPC Class Codes: A61L 2300/412 Tissue-regenerating or healing or proliferative agents
• CPC Class Codes: A61L 2300/434 of enzymes

Abstract

A wound dressing makes use of a polysaccharide, such as Manuka honey, in combination with collagen in order to suppress the efficacy of matrix metalloproteinases enzymes (“MMPs”) present in chronic wounds. The mixture is applied to an absorbent surface that is designed to absorb the mixed polysaccharide only partially.

Claims

1. A dressing for application to a wound comprising:

a wound contacting layer for contacting the wound surface, the wound contacting layer comprising;

a first polysaccharide; and

an MMP suppressing material.

2. The dressing of claim 1, wherein the first polysaccharide is honey.

3. The dressing of claim 2, wherein the MMP suppressing material is collagen.

4. The dressing of claim 3, wherein the collagen is powdered collagen.

5. The dressing of claim 2, wherein the wound contacting layer comprises greater than 90% by weight of honey.

6. The dressing of claim 5, wherein the wound contacting layer comprises less than 10% by weight of collagen.

7. The dressing of claim 2, wherein the wound contact layer comprises between 10% and 45% by weight of honey.

8. The dressing of claim 7, wherein the wound contact layer comprises between 55% and 90% by weight of collagen.

9. The dressing of claim 1, wherein the wound contact layer further comprises a supplemental material.

10. The dressing of claim 9, wherein the wound contact layer comprises less than 50% by weight of honey.

11. The dressing of claim 10, wherein the wound contact layer comprises greater than 50% by weight of the supplemental material.

12. A dressing for application to a wound comprising:

a wound contacting layer for contacting the wound surface, the wound contacting layer comprising;

a first polysaccharide having a first viscosity;

a supplemental material; and

an MMP suppressing material;

wherein the first polysaccharide, the supplemental material and the MMP suppressing material form a mixture in the wound contacting layer having a viscosity that is greater than the viscosity of the first polysaccharide.

13. The dressing of claim 12, wherein the supplemental material is cane sugar.

14. The dressing of claim 12, wherein the supplemental material has antimicrobial properties.

15. The dressing of claim 14, wherein the supplemental material comprises silver.

16. The dressing of claim 12, wherein the MMP suppressing material is collagen.

17. The dressing of claim 16, wherein the wound contact layer comprises between 10% and 45% by weight of honey.

18. The dressing of claim 16, wherein the wound contact layer comprises between 40% and 80% by weight of the supplemental material.

19. The dressing of claim 16, wherein the wound contact layer comprises between 10% and 50% by weight of collagen.

20. A dressing for application to a wound comprising:

a wound contacting layer for contacting the wound surface, the wound contacting layer comprising honey and collagen;

a film layer;

an absorbent layer; and

a cover layer;

wherein the wound contacting layer is applied to the film layer.