BOTTOM GATE TYPE THIN FILM TRANSISTOR, METHOD OF MANUFACTURING THE SAME, AND DISPLAY APPARATUS
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Abstract
Provided is a bottom gate type thin film transistor including on a substrate (1) a gate electrode (2), a first insulating film (3) as a gate insulating film, an oxide semiconductor layer (4) as a channel layer, a second insulating film (5) as a protective layer, a source electrode (6), and a drain electrode (7), in which the oxide semiconductor layer (4) includes an oxide including at least one selected from the group consisting of In, Zn, and Sn, and the second insulating film (5) includes an amorphous oxide insulator formed so as to be in contact with the oxide semiconductor layer (4) and contains therein 3.8×1019 molecules/cm3 or more of a desorbed gas observed as oxygen by temperature programmed desorption mass spectrometry.
91 Citations
15 Claims
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1-9. -9. (canceled)
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10. A thin film transistor, comprising on a substrate:
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a gate electrode; a first insulating film as a gate insulating film; an oxide semiconductor layer as a channel layer; a second insulating film as a protective layer; a source electrode; and a drain electrode, wherein the oxide semiconductor layer comprises at least one of a Sn—
In—
Zn oxide, an In—
Zn—
Ga oxide, an In—
Sn oxide, an In—
Ga oxide, an In—
Zn oxide, and an In oxide, andwherein the second insulating film is formed in an atmosphere including an oxidizing gas so as to achieve an on/off ratio of the transistor of 105 or more. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification